Electronics Forum | Thu Aug 08 10:58:18 EDT 2002 | Tom Gervascio
I'm interested in sharing any information on bumping of LAnd Grid Array (i.e. QFN) packages. due to PCB contraints, it's not possible to stencil paste onto sites for QFNs. That lead to a lot of experimentation with bumping of 6 mm QFN packages.In sum
Electronics Forum | Thu Apr 11 18:26:30 EDT 2002 | TomN
I know the information is out there somewhere, but I need to find information on cost models that apply to reworking motherboards. I had this task dropped in my lap and I�m trying to turn this around quickly. Some background: Products that are diag
Electronics Forum | Fri Apr 26 20:11:51 EDT 2002 | stefwitt
Ian was quite right, mentioning the Nitto patent. It is Pat# 4,820,369 from April 1989. The idea is great, but there are quite some hick-ups in practise. P.S. The reasons for the difficulties with the �cover tape curl� are easily explained. Try to
Electronics Forum | Tue May 07 05:55:58 EDT 2002 | ianchan
Hi mate, do you mean : 1) Au = "ENIG" or "immersion Au(gold)"? or 2) Ag as in = "silver"? If Au is the correct term, no need to make extreme changes in your profile. just keep the profile to within your paste specs of preheat, reflow time and reflo
Electronics Forum | Mon May 27 12:14:35 EDT 2002 | arcandspark
I use the exact same paste flux that we use in our solder paste for SMT manufacturing with great success. I have also had great success using the Air Vac DRS Hot Gas units with the same size BGA's. If to much heat is applied to fast to the BGA be it
Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi
*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about
Electronics Forum | Mon Jun 03 21:02:42 EDT 2002 | ianchan
Ok let's start backwards abit, and move progressively from a common understanding. So this originator thread-slinger bloke is asking for advise to Au plate his connector pads. We have a cuppa ideas bounced around which leads to my ignorance based q
Electronics Forum | Fri May 31 17:04:02 EDT 2002 | davef
We use boots / shunts er wutt ever you call them to protect solderable component surfaces from wave soldering. Not sure how it would work in your case try: * Kinnarney Rubber 450 Main St. P.O.Box 37 Mantua, N.J. 08051 609-468-1320 fax 7438 http://ww
Electronics Forum | Fri Jun 14 14:05:22 EDT 2002 | mjabure
Never try to convince an exec. staff to change manning policies using efficiency, it's a losing cause. Look at your audience, they probably all have MBA's which means they only look at the dollars and cents. To them those aren't production machines o
Electronics Forum | Tue Jun 18 21:17:00 EDT 2002 | Todd
Gee Ken, the old cart business must really be slow, I see you commenting on any old item in the forum in an attempt to hawk your carts and how they improve efficient factory operation. I have read your white paper and found it very entertaining to se