Electronics Forum: tri (Page 691 of 941)

Re: Poor Solder on TSOP

Electronics Forum | Tue Jun 30 11:51:41 EDT 1998 | Michael Fogel

| | I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everyt

Re: Poor Solder on TSOP

Electronics Forum | Thu Jul 02 19:18:31 EDT 1998 | Rin

| | | | I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. E

A bit more than Traveling Salesman Problem

Electronics Forum | Sat Jun 27 02:30:41 EDT 1998 | Erhard

You will have to forget about the idea of finding ONE algorithm to optimize SMT placement. For pick and place, collect and place, turret type "chip shooters" with moving feeder cartridge and moving board you will each have to find your own algorithm

Re: Solder under bottomside SMT components

Electronics Forum | Fri Jul 10 14:40:12 EDT 1998 | Bob Willis

Yes this can be a killer. Its caused by glues with a high water content or fast curing of glues. When you get solder going through the glue it is litterally sucked in during solder wave contact. If you have never seen it you would never believe it bu

Another Suggestion On DoE

Electronics Forum | Fri Jul 03 09:19:21 EDT 1998 | Dave F

| | | | | WHAT IS THE BEST ANGLE FOR THE SQUEEGEE BLADE TO BE ANGLED AT? WE ARE USING 45 DEGREE ON OUR POLYURETHANE BLADES, AND I BELIVE WE HAVE THE OPTION OF EITHER 45 OR 60 DEGREES ON OUR METAL BLADES. WHICH OF THE TWO IS BETTER, OR SHOULD WE BE

Re: Cpk measurement

Electronics Forum | Thu Jun 18 19:17:16 EDT 1998 | Ben Salisbury

| I am currently using some pick & place equipment and would like to measure their cpk using a glass plate and glass "components" with vernier scales. I have seen these kits but am trying to track a supplier down in UK/Europe. | Any help is much appr

contamination problem on boards after wave soldering

Electronics Forum | Wed Jun 17 16:08:37 EDT 1998 | upinder singh

We are facing a problem of high contamination on boards after wave soldering. We want the contamination to be under 24 ugm/inch square. We are using a no clean flux with the spray fluxer unit of wave soldering. The contamination is higher on the end

Re: straddle mount connectors

Electronics Forum | Fri Jun 26 19:59:07 EDT 1998 | Scott McKee

| can any body help on assembling straddle mount connectors on to a board? for information on the connector - it is a berg micropak connector 1. You need a fixture to insure the pins don't bend while inserting them on the board, coplanarity is a re

Re: Siemens siplace for high mix/medium to low volume

Electronics Forum | Sat Jun 13 00:45:49 EDT 1998 | Phillip Hunter

Is cost an issue? I evaluated Siemens Siplace about a year ago and the price per placement was twice what Phillips Machinery has to offer. We too are a high mix/low PCb count shop. Also, Siemens has many hidden costs and the references I talked to

Re: Siemens siplace for high mix/medium to low volume

Electronics Forum | Fri Jun 12 11:54:55 EDT 1998 | Rin Or

| I am currently in the process of trying to justify new equipment in my factory. I currently have Siemens siplace 15 series machines. I don't feel thins equipment is right for high mix/ medium to low Volume. I am running up against a in house con


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