Electronics Forum | Thu Sep 27 10:28:29 EDT 2001 | John S
It seems to depend on your situation. We're an OEM manufacturer and run the same products for extended periods of time. We monitor process indicators such as Dave listed, but we also monitor process defect trends. This is product specific of cours
Electronics Forum | Fri Oct 05 08:35:52 EDT 2001 | Hussman
Hey Steven, Achieving the proper profile like you described does require you to engineer proper conveyor speeds and zone temps. Most conveyorized ovens have the inside of the ovens divided into zones. Each zone has a top and bottom heater that can
Electronics Forum | Tue Oct 16 18:42:32 EDT 2001 | mparker
I go with DaveF's advice. You are probably curing the glue too fast. Another phenomenon that I have experienced was during glue cure and solder paste reflow simultaeously. A good reason to run a glue cure profile seperately from solder paste reflow
Electronics Forum | Wed Oct 17 10:21:08 EDT 2001 | genglish
Cheers guys for your rapid response, I investigated the problem further today, eventually I cam round to curing the adhesive in a sandwich of microscope slides resting on the PCA in question (hopefully mimicking the heat transfer), the adhesive is sp
Electronics Forum | Thu Oct 25 16:48:29 EDT 2001 | Cemal Basaran
We can inspect and measure strain field in anything larger than 320nm with Laser techniques we have. We can do this measurements during fatigue testing. Of course thick intermetallic region as a solid region is a problem due to the fact that you ha
Electronics Forum | Wed Nov 07 21:16:44 EST 2001 | davef
Consider using the following hierarchy of rules for pad design: 1. If you have a land pattern in a manufacturer�s data sheet, use it. 2. If the data sheet doesn't have a land pattern, but does have an RLP (registered land pattern) number or JEDEC n
Electronics Forum | Mon Nov 12 16:12:55 EST 2001 | davef
Years ago, we used a specialty-marking pen like you describe. The pen has: * �Fluxmarker 6135 W BELMONT CHICAGO IL 60634 / 1-312-889-8323 Illinois / All other states Toll Free 1-800-621-0080 bla bla bla � marked on the barrel. A quick search with G
Electronics Forum | Tue Nov 20 12:48:40 EST 2001 | tony_sauve
We recently experienced a problem w/voids (up to 65%) in uBGA solder joints. The only joints that have the problem correlated to pads which had blind 0.006" via's in them. The via's only extend down 2 layers, of the 18. 21 BGA's on the PCB, only expe
Electronics Forum | Sun Dec 09 22:54:20 EST 2001 | dburr
It sound you have already discovered to root cause, flux entrapment in the via holes. Short of changing the desing, here are sone suggestions. The main thing is you have to dry out the via holes of the wet flux. Some things to try are: slow down t
Electronics Forum | Tue Nov 27 16:18:34 EST 2001 | MikeF
Can anyone give me a brand name on a chair with casters that only rolls when it has weight on it? A couple of jobs ago we had chairs for the operators that would only roll after someone had sat down, that way they would not roll away while someone wa
