Electronics Forum: tri (Page 801 of 941)

Re: Home plate or bow tie?

Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll

I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o

Re: Screen printing glue for wave soldering SMT components.

Electronics Forum | Mon May 29 02:15:06 EDT 2000 | Dreamsniper

Hi Buddy, We've tried shifting to this process before and from our point of view here are some of the advantage and disadvantages that we discovered. Advantage 1) Cheap Equipment cost as you just need to use your Solder Paste Printer rather than buy

Re: Where's Earl Moon ?

Electronics Forum | Thu May 11 21:12:09 EDT 2000 | Dave F

Andy: Welcome. Several points: 1 Be careful in your statistics quoting reverie, particularly on archives use. September was about the time of one of the server upgrades. As part of one of those changes, the previously outstanding, although sadl

Re: Wave Soldering No-Clean Bottom-Side SMT

Electronics Forum | Tue May 02 12:17:22 EDT 2000 | C.K.

Donnie is correct. "NO-Clean" doesn't translate to "no-residue!"..... who's giving you hassle about this - your ICT guys??!! Residue remaining on your PCB substrate is a function of many different things - flux deposition, solder mask (glossy means

Re: BGA REFLOW PROBLEMS

Electronics Forum | Mon Mar 27 20:48:25 EST 2000 | Dave F

Robert: Howya doin' bud? You say "BGA Shorting!!!" I say "Too Much Solder!!!" So, earlier comments about aperture design are appropriate, make good points, and I think we both agree that improvements could be made in your stencil design, but I'm

Re: Reliability of Reworked Pads/Traces?

Electronics Forum | Wed Mar 29 09:31:28 EST 2000 | Erick

Marc: My experience found reliability IS a function of operator skill and attension to the process. Expecially for some RF assemblies. I worked with an engineer from Rogers to develope a process for reworking Pads for a special material. (I thing

Re: Reflow Power Failure

Electronics Forum | Wed Mar 01 16:52:43 EST 2000 | Dave F

Hey Hany: Here yago: On power outages: Talk about fun!!!! Can we have more of �em?? � You�re correct that a UPS to run your reflow is very expensive, but all you have to run is the belt motor. That�s "cheap!!!!" Get UPS sizing information from

Solder at gold finger

Electronics Forum | Mon Feb 05 20:43:27 EST 2001 | davef

1 Solder on gold fingers comes from: 1a About 70 % of the time it's caused by poor cleaning of screen printer, staging area (table), conveyor, reflow oven chain or belt, and keeping boards separate from cleaning process 1b After loading paste onto

Solder Pot Temperature

Electronics Forum | Mon Feb 05 06:57:52 EST 2001 | PeteC

Dason, IPC/EIA J-STD-001C states: "....temperature within the range of 230C (446F) to 290C (554C)." That's a pretty wide process range. 250C has been typical in the past. We run ours from 230C to 240C. We have found that some single-sided PCBs can de

solder balls

Electronics Forum | Wed Feb 07 21:56:00 EST 2001 | davef

Every critter out there with large incisors adapted for gnawing and nibbling has a different theory of solder ball formation. [My theory: It�s punishment for using NC fluxes. Stand and deliver. My solder balls end-up in the gross filter connected


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