Electronics Forum | Wed Jul 07 22:59:06 EDT 1999 | Dave F
| Hi! | I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board uniformi
Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi
Electronics Forum | Tue Jul 06 16:44:14 EDT 1999 | John Thorup
| Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. Th
Electronics Forum | Wed Jun 30 10:37:11 EDT 1999 | Boca
We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Inste
Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner
| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins
Electronics Forum | Mon Jun 28 16:18:44 EDT 1999 | Earl Moon
| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar
Electronics Forum | Mon Jun 28 17:03:59 EDT 1999 | M Cox
| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar
Electronics Forum | Thu Jul 01 13:57:57 EDT 1999 | Kris Wiederhold
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Fri Jun 25 09:51:35 EDT 1999 | C.K.
| Dear John/Earl | | Thanks for your clarifications. To me also the problem does not seem to be linked with the PCB. The Pre heater temp. is set at | 450 degree C. We are using Alpha Aq. cleanable flux. Can you elaborate on the Desired profilin
Electronics Forum | Fri Jun 18 20:09:52 EDT 1999 | Dean
| Has there anyone bold enough to try this in their shops? My cubemate just got through telling me that at his last shop, they had bare copper boards (no HASL, no OSP, no nothing), with minimal solderability problems. | yes, 8 years ago I developed
