Electronics Forum: tri (Page 826 of 941)

Pad Sizes

Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler

I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.

Peelable solder stop

Electronics Forum | Wed Dec 23 03:33:14 EST 1998 | Charles Stringer

Can anyone recommend a solder stop that can be applied by our PCB supplier. Our current material form Tamura Kaken is causing problems. The material should be capable of withstanding 1 Surface mount IR reflow cycle and 1 wave solder cycle. We need t

Re: QFP On both side of a board

Electronics Forum | Fri Dec 11 16:06:18 EST 1998 | Michael Allen

G, You'll find at least one old thread in this Forum on dual-reflow if you do a search. I found one dated April 7, '98 (searched on "reflow"); this particular thread includes a discussion about the maximum weight-to-surface_area for successful dual

Cookies ala mode

Electronics Forum | Thu Dec 10 09:02:34 EST 1998 | Clifford Peaslee @ SMTnet

| While trying to access this web site you sent over 10 "cookies" A bit overdone, isn't it? | Maybe. But I dont think so. Cookies are essential for SMTnet's future plans as a dynamic web site with personalization. You can browse the site, and we

Re: Reflow Profiling

Electronics Forum | Fri Nov 27 09:00:48 EST 1998 | Christopher Lampron

| Hi | I have been conducting my first reflow profiles. Most of the texts that I have read suggest soldering the thermocouples to a populated pcb. I am finding this very difficult. I have been using a high melting point (Sn5 / Pb95) solder and the

Re: Help-Wire Bonding Defects Analysis After Encapsulation

Electronics Forum | Thu Dec 03 13:39:52 EST 1998 | Russ M

| | | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure

Re: No Feeder Compatibility with Gem Series

Electronics Forum | Wed Nov 25 01:43:40 EST 1998 | Erhard

| Can anyone tell me why Philips would obsolete my feeders. I am trying to add a newer machine to my line and I am told that the feeders from my 84VZ no longer work. Is this true? | The feeders were all compatible from the Philips CSM 66 up to the

Re: No Feeder Compatibility with Gem Series

Electronics Forum | Mon Nov 30 16:48:48 EST 1998 | Brian McCarthy

| Can anyone tell me why Philips would obsolete my feeders. I am trying to add a newer machine to my line and I am told that the feeders from my 84VZ no longer work. Is this true? | Not exactly. Mechanical feeders for the CSM-66/84/VZ are not usa

Re: Problems with wave solder

Electronics Forum | Mon Nov 23 19:34:51 EST 1998 | Mike Demos

Charles: Here are a few possibilities you might want to check: 1) Conveyor width -- if the conveyor is too tight this will cause the boards to buckle as they go through the preheat section. We recently had this happen when we changed operators. 2

Re: Floating 144-pin QFPs

Electronics Forum | Thu Nov 19 05:25:07 EST 1998 | karlin

| | We are experiencing 'lifting' on one or more sides of a QFP. Poor lead co-planarity has been ruled out by independent tests. Please tell me which of the two remaining failure modes is the most probrable? | | | | 1. Expansion of gases in vias und


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