Electronics Forum | Tue Nov 20 09:50:07 EST 2007 | rgduval
Only on the bottom side? Run that side first . We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend
Electronics Forum | Fri Nov 30 18:27:32 EST 2007 | jmelson
This doesn't help the original poster any, but does the Quad have any sensing of what is going on in the feeder? On the pneumatic or mechanical Philips feeders, if the tape jams in the feeder for some reason, the head just keeps tapping the lever an
Electronics Forum | Wed Dec 19 14:44:54 EST 2007 | Paul M.
Kelca..... I don't think yer getting the picture here. These boards are supplied by the customer. They are "Labor Only" accounts. We have NO control of the PCB's or any of the parts for that matter. These Labor Only customers show up at the back doo
Electronics Forum | Mon Dec 17 09:15:57 EST 2007 | kpm135
I have personally worked with MYData, Quad, and Panasonic in the past. We are a High Mix, Low Volume CM. The plan that is in the works is to use the CP6 to place all chip components and then use our MYData TP9 or MY12 to place the rest of the compone
Electronics Forum | Fri Dec 21 10:54:17 EST 2007 | isd_jwendell
All or nothing You do not need to purchase everything all at once. You can start with the manual stencil printer and oven, which are the lower cost items and easiest to maintain. Placing parts by hand will be very time consuming, but you can do a fe
Electronics Forum | Fri Dec 21 09:20:36 EST 2007 | operator
Hello All, I read AIMs article "Time Above Liquidus". It was very informative and a good read. One thing that the article didn't touch on, that is a mystery to me, is thermal shock to components during the ramp up stage of a profile. If you
Electronics Forum | Mon Feb 04 16:29:39 EST 2008 | tonyamenson
I have been trying to eliminate the troublesome tubed parts in our SMT process but because we are a high mix/low-medium volume we still have to deal with it sometimes. However, the ones I can fix I'm working on. The next step in my war against tubes
Electronics Forum | Wed Feb 13 19:32:02 EST 2008 | daxman
Greetings everyone. We are currently doing some experimentation with solder paste printing over ground planes. In this application, the entire perimeter of the PCB is a ground plane. It's about 4mm wide and wraps around the whole PCB; There is no so
Electronics Forum | Tue Apr 01 07:21:16 EDT 2008 | davef
First, your idea of having a safety glass policy is good. The glasses should meet ANSI Z87.1-2003. [Although, ANSI Z87.1-1989 and ANSI Z87.1 are fine for electronic assembly.] Here's a comparison of the 1989 and 2003 standards: http://www.tasco-safet
Electronics Forum | Tue Apr 15 15:10:28 EDT 2008 | markhoch
We currently are using an older Electrovert Convection 7-Zone reflow oven for our Lead-Free assemblies. It has a maximum per zone Temperature setting of 280 Degrees C. This is causing an issue with one particular customer who has a fairly dense produ
.gif)
