Electronics Forum: tssop reliability (Page 1 of 1)

temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 12:25:43 EDT 1998 | Dave Hammond

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whether

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 12:33:43 EDT 1998 | Earl Moon

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 13:57:33 EDT 1998 | Mike C

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 14:05:54 EDT 1998 | Earl Moon

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe

Fuji Pick and Place Machines

Electronics Forum | Fri May 07 07:02:52 EDT 2004 | rlackey

Hi Grant, We use the CP series from Fuji - so not quite the same, but the quality of engineering and company philosophy will almost certainly carry over into the XP range. Our machines are totally bombproof reliability wise, and the programming i

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