3 tsvetan usunov results

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6 layer board and routing bga package

Electronics Forum | Fri Feb 19 05:08:40 EST 2016 | truewanderer

Thank you Tsvetan Usunov

Tombstone components issue after reflow?

Electronics Forum | Fri Aug 18 03:46:29 EDT 2017 | stivais

The first reply from Tsvetan Usunov already answered your question - there are no thermals for one side of the chips. You can try to reduce the phenomenon by using different solder pastes, tuning your soldering profile or even switching to different

Tombstone components issue after reflow?

Electronics Forum | Thu Aug 24 00:05:14 EDT 2017 | heros_electronics

The first reply from Tsvetan Usunov already > answered your question - there are no thermals > for one side of the chips. > > You can try to > reduce the phenomenon by using different solder > pastes, tuning your soldering profile or even > swi

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