Electronics Forum | Thu Jan 21 09:27:33 EST 1999 | Earl Moon
Hello, I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all the re
Electronics Forum | Fri Sep 25 06:39:15 EDT 1998 | Wayne Bracy
| Does anyone know where I can get conductive benchtops? NOTE: I don't want a mat and I'm already using (and unhappy with) a laminate surface glued to a wooden table. Any and all info would be very much appreciated. | BTW: I'm also looking for conduc
Electronics Forum | Tue Apr 28 10:09:59 EDT 1998 | Scott Davies
| | Where can I find pliers to accept a round standoff? | Scott: Two ideas come to mind: | 1. change the stand-off round to to a hex shape | 2. if you must use the round shape, go to Sears, buy a "robogrip" and a pack of the platic inserts that fi
Electronics Forum | Wed May 29 15:29:41 EDT 2002 | zanolli
Hello Peterson, If the contact tails protruded enough on the underside of the PCB, then you could do a "reverse" press fit. I do not believe that to be the case with the VHDM. Placement equipment is out of my bailiwick but; Usually small SMT connec
Electronics Forum | Thu Jun 06 07:53:51 EDT 2002 | Jim M.
Has anyone had much luck Picking and Placing die with a Panasonic MPA-G3?What special setups or considerations are required? Currently we pick and place one die with our Universal GSM using only one nozzle. The nozzle must be painted white in order
Electronics Forum | Wed Aug 21 18:13:21 EDT 2002 | johnlee
Kevin, There are a number of custom integrated systems that perform automated insertion of "odd" components. These system use either a robot or cantilevered X,Y,Z Cartesian motion systems. Our systems have accepted standard and custom component feede
Electronics Forum | Wed Dec 18 19:52:25 EST 2002 | kennyg
Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the part
Electronics Forum | Mon Feb 24 10:21:29 EST 2003 | ryanm
Just an update on my problem. I spoke to Loctite and they had very few solutions. One thing they suggested to try was to add a thirty-second soak time at 150 degrees to my reflow profile. The problem with that is ramp-soak-spike profiles doesn�t s
Electronics Forum | Tue Mar 18 17:13:47 EST 2003 | Carol Stirling
Hi -to all those familiar with MSL, I have a few questions on Moisture Sensitivity Levels (MSL) with ICs. We have been assured by our distributers they mark any package of ICs shipped according to J-STD-033. We receive ICs marked as Class 3 and up,
Electronics Forum | Mon Feb 09 14:31:38 EST 2004 | Brent
There is standard pick and place equipment such as the Assembl�on (formerly Philips EMT) ACM Micro and AQ-1 that can easily handle your snap-fit through-hole BNC connectors, in addition to other surface mount components and through-hole odd form part
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