Electronics Forum | Sat Sep 05 08:55:57 EDT 1998 | Dave F
| We are writing to have information about the automatic mounting process of flip-chip. | We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). | Thanking yo
Electronics Forum | Thu Feb 06 12:30:24 EST 2003 | rboulanger
You can upgrade GSM machines to process flip chips. Yes, you do need special software and nozzles and probably a new camera with more resolution.
Electronics Forum | Fri Sep 04 09:39:54 EDT 1998 | jim foley
:I believe it can be easily done using the universal GSM platform. You may want to contact Universal instruments corp. in Binghamton NY for further information. We are writing to have information about the automatic mounting process of flip-chip.
Electronics Forum | Mon Apr 23 11:58:42 EDT 2001 | CAL
I personally like Universals GSM and the Siemens F series for placement machines and companies. Both have great laboratorys set up for Flip Chip processing.Both Also have industry leading experts on staff. Machine info: can they do tacky flux dispen
Electronics Forum | Tue Nov 10 17:23:51 EST 2009 | gregcr
GSM's are only 500 to register with UIC. There are a ton of GSMI's around. We have always run chipshooters with GSM's and now the new Advantis machines from UIC. GSM's are very accurate, but a bit of a pain if your running lots of chips (thus we r
Electronics Forum | Thu May 25 17:32:36 EDT 2006 | TomL
Log on to Universal's website "uic.com", and register to "MyUniversal". From there you will have access to the GSM Knowledge Database, where you will find best practices guides for running chips, and much more. Bulletins TECH-0138 & TECH-0139 shoul
Electronics Forum | Fri Jan 10 08:52:31 EST 2003 | nifhail
We are typical SMT subcontracting house. Recently I received RFQ for brds with DCA or Flip Chip technology. In our factory we only have typical SMT machines i,e Printer-HSP chipshooter-GSM IC placer-reflow oven. What are additional machines and pro
Electronics Forum | Thu Feb 06 14:27:18 EST 2003 | MA/NY DDave
Hi You already have some good answers. Let me add just a little of what I know. You might want to check the IPC and obtain their guides on this technology. Also SMTA, NEPCON and others have technical proceedings on this technology. Checking with e
Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach
What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.
Electronics Forum | Mon Jan 29 15:21:56 EST 2007 | flipit
If you teach your feeders, you can no longer gang pick correct? I have never had a dual beam or dual head GSM before. However, if you teach feeders with the fiducial camera and your picks are still off, there is an offset in one or several spindles
