Electronics Forum | Fri May 31 12:28:45 EDT 2019 | slthomas
You really need to define what you mean when you say "bend" and when you say "break". You might have zero damage to a bare board but cracked solder joints and ceramic caps on an assembly, given the same amount of bending or stress. It all depends on
Electronics Forum | Wed Feb 16 20:50:57 EST 2022 | mihai_voivod
Its hard to answer your questions with fuzzy pictures, no background, or a schematics/BOM. Your best bet for good answers is to contact the manufacturer or obtain another board so you have spare parts. In the 1st picture The epoxy is there probably t
Electronics Forum | Fri Oct 11 09:28:14 EDT 2002 | davef
Designers love to do BIG copper pours for several reasons: * Maximize heat spreading. * Increase EMI shielding. * Laziness. The poor folk that solder the parts on boards HATE big copper planes near solder pads. During soldering, fat copper traces [
Electronics Forum | Tue Jul 09 08:29:10 EDT 2002 | r_sturdevant
I agree with others here who have questioned the amount of solder and reliability of the joint when using this aperture shape. I have had experience with these with MELFS, and the main issue I've seen comes when cleaning the stencil - all those littl
Electronics Forum | Fri May 12 11:48:35 EDT 2000 | Mike Konrad
Advantages of using a stencil cleaner verses manually cleaning stencils: 1. Using a stencil cleaner ensures no direct contact between operator and solder paste (lead being the primary concern). 2. Most stencil cleaners remove 100% of the solder p
Electronics Forum | Tue Mar 20 04:40:15 EDT 2018 | rob
I've seen them down at 2 metres in the past, but usually only 4 zone. from memory Electrovert used to do a small 5 zone with pin chain - Infraflow 500 or something. To be fair, even small one line CEMs usually have a decent oven as you need to be a
Electronics Forum | Fri Jan 19 07:54:56 EST 2007 | realchunks
I believe you are describing a pin in paste process. Not sure where a stencil is involved. Depending on you machine/pump, you can do damage to it by running paste thru it. Paste is a metal and will wear out internal parts. Also, most pastes used
Electronics Forum | Tue Feb 10 02:14:39 EST 2009 | emmanueldavid
Smartasp, Seems this issue is certainly making a long thread ! As far as our Experience is concerned on Reflow Soldering, particular parts must have failed in LSLs [Lower Specification Limit] and have not withstand well under USLs [Upper Specificat
Electronics Forum | Fri Oct 08 16:36:28 EDT 1999 | Glenn Robertson
| We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 7
Electronics Forum | Wed Dec 10 08:30:20 EST 2008 | rgduval
Are you using no-clean solder, or just no clean flux? If you're using a solder with WS flux in the core, and a no-clean flux; we'd suggest switching to a WS flux to help during the soldering. If you are using a no-clean solder/flux combination, you
