Electronics Forum: ultrasonic and damaged and solder and joint (Page 1 of 1)

ICT and specifying PCBA testing

Electronics Forum | Thu Mar 25 12:24:12 EDT 2010 | ssager

When testing components on a PCBA, try to validate coverage for presence, correct, orientation, live, and alignment. AOI is not really great at catching cold solder joints and damaged components, and from my experience an X-Ray is only as good as the

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef

Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Tue Aug 28 13:46:46 EDT 2001 | mparker

To clarify on "Opportunities"- With 1000 components, the opportunities are far greater than 1000. You have 1 opportunity per component for a component defect i.e. bent lead, damaged part, tested bad, etc. You have a second opportunity per component

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