Electronics Forum: underfill keep out (Page 1 of 112)

What is the best way to keep ESD totes clean?

Electronics Forum | Fri Nov 18 11:51:47 EST 2011 | rway

Much ado about nothing. Reminding has failed? Who runs the place? You sound like you are a person in authority. You may not be the boss, but authority has weight. The folks that can't seem to remember (or care to remember) have bosses that you c

BGA underfill necessary with conformal coat?

Electronics Forum | Tue Apr 02 22:52:38 EST 2002 | davef

Tks BT Can't be many places tougher than automotive, 'cept maybe oil field, down pipe. We use Dexter Hysol flow underfills for both 1 thou and 3 thou gaps, but they wouldn't come close to filling under a BGA. Most BGA are sitting about 16+ thou fr

Parting out GSM2

Electronics Forum | Thu Jul 21 21:36:46 EDT 2022 | ttheis

We are parting out a GSM2 machine and plan to keep most of the parts for spares but if there is some bracket, bearing, roller, switch, etc. that someone needs let me know asap and we'll see if we have it.

Solder Paste Dry out

Electronics Forum | Thu Feb 28 14:50:02 EST 2008 | tonyamenson

Let me clarify we throw out used paste after a week not the whole jar. Jars get used up every other day or so. We don't really have a procedure for used paste on the do's and don'ts so I'm in the process of creating one to avoid people adding flux t

Time to get out

Electronics Forum | Thu Mar 21 00:01:46 EST 2002 | jbutile

Can anyone give me a good reason to stay in this industry. I really do not want to be the last one in this forum while I see all my friends move on to other jobs, reasonable pay and security. From all I can tell it is over, there is nothing left to

Axial capacitor Pull out force

Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef

There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea

Throw out component from - placement machine

Electronics Forum | Thu Jul 20 19:51:40 EDT 2006 | darby

Are you trying to tie someone to an agreed wastage level or are you being tied? What machines are you talking about? What components are you talking about? The only acceptable wastage level is zero: but you can't get to zero until you've had some was

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef

There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si

Re: Alternatives to device bake out

Electronics Forum | Mon Feb 22 12:20:51 EST 1999 | Dave F

| Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. | I have come accross dry nitrogen storage cham

Use of solder paste after taking out from cold storage

Electronics Forum | Fri Nov 18 01:50:56 EST 2005 | ajay

in such cases we keep used paste in box & it is on the machine

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