Electronics Forum: underfill keep ouy (Page 1 of 2)

Underfilled BGA Removal

Electronics Forum | Fri Mar 28 10:21:16 EDT 2014 | davef

With heat, most underfills soften just before the solder melts. So, keep poking the underfill until you see it soften. Then, wait just the correct amount of time until the solder melts and quickly snap or torque the part from the board. BR davef

Underfill machine maintenance

Electronics Forum | Tue Nov 08 20:20:32 EST 2005 | davef

Necessary tools are: * Chisel * Ball peen hammer After you buy two new nozzles, keep one in a baby food jar filled with your underfill suppliers recommended solvent for half the shift. At the break, swap the dirty nozzle on the machine with the cle

BGA underfilling

Electronics Forum | Thu Nov 15 20:42:59 EST 2001 | davef

Hey Terry. You make points that would be interesting to many here on SMTnet. Your suggestion to take this conversation off-line and onto e-mail is not in the spirit of sharing knowledge that we on SMTnet cherish. Please keep this conversation on-l

BGA underfilling

Electronics Forum | Mon Nov 12 12:29:52 EST 2001 | caldon

One of the key elements you need to keep in mind......What "Contaminates" are you trapping in with the undefill. In my personnal opinion I do not think you will gain anything. I would spec a component best suited for that environment. I know ACI has

Shielding from Nearby Heat-Any Tricks

Electronics Forum | Wed Dec 24 18:31:04 EST 2008 | hegemon

If they share a common ground plane you are in for some difficulty in trying to prevent the second part from heating too much. What happens to the underfill material when it is softened by being heated beyond the 160C? Does it harden up again, or b

Re: Flip Chip and lead-free soldering

Electronics Forum | Thu Jul 20 16:15:24 EDT 2000 | Bob Willis

Sorry at the moment I do not have information but as usual I want to get some hands on sessions going. We were doing a flip chip workshop hands on session for Speedline last week in England. We did the theory and then hands on soldering and underfill

Processing questions - PCB and BGA's

Electronics Forum | Fri Jan 30 14:20:55 EST 2009 | scottp

I do a lot of thermal cycle testing of new components for my company and often when I lay out a test board I'm trying to simulate 4 or 6 layer boards but I don't need them for routing so I just use a solid fill of a cross-hatch pattern. I've done it

Re: uBGA

Electronics Forum | Tue Jul 13 13:51:51 EDT 1999 | Earl Moon

| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t

Re: uBGA

Electronics Forum | Tue Jul 13 15:04:24 EDT 1999 | Scott McKee

| | | | Hi all , | | | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | | | 2. What type of stencil a

Re: "Superboy" needs HELP

Electronics Forum | Wed Jun 24 21:32:07 EDT 1998 | Jon Medernach

Sorry Earl but as Superboy's dad I believe that makes me Superman as we did not remove him from the wreckage of a spacecraft. There is quite a bit involved in the FC process. The Kyushu Matsushita Electric Research Labs has been developing Flip Chi

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