Electronics Forum | Mon May 18 08:59:41 EDT 2009 | ozgurv
Dear All, Does anyone on the forum have experience with underfilling process of bga? We have a component with 0.5mm bga on one of the new products. Customer wants this component to have an underfill. Questions - 1) which kind of epoxy or chemica
Electronics Forum | Tue May 19 06:57:33 EDT 2009 | cunningham
whats the reason for the underfill? we dont underfill any of our BGAs rework could be a issue if they need to be replaced? tried DP190?
Electronics Forum | Wed Jul 01 18:49:27 EDT 2009 | stevenlimth
1smtdude, I interested in your explaination of re-work an underfill part. You mention the material can be heated to a plastic state to become vicious... do you know usually what range is the temperate? (guess it can depend on the type/manufacturer o
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Tue May 19 08:07:56 EDT 2009 | davef
Search the fine SMTnet Archives to find threads like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=58257
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Tue Jul 14 18:42:41 EDT 2009 | anndi
1smtdude, I interested in your explaination of > re-work an underfill part. You mention the > material can be heated to a plastic state to > become vicious... do you know usually what range > is the temperate? (guess it can depend on the > type
Electronics Forum | Fri May 22 16:00:54 EDT 2009 | pjc
Henkel- Hysol seems to be the most popular material that I see: http://www.henkel.com/cps/rde/xchg/SID-0AC83309-B331D246/henkel_com/hs.xsl/12169_20090505-henkel-launches-next-gen-underfill-20681_COE_HTML.htm As far as application method, its all ab
.jpg)
