Electronics Forum: uneven (Page 1 of 16)

Chip Capacitor Uneven Surface

Electronics Forum | Mon Sep 28 16:22:20 EDT 2009 | davef

When does the uneven surface occur? * Incoming * Reflow * Cleaning * Wave soldering * Some other process, where?

COMPONENT DROP DURING SECOND SIDE REFLOW

Electronics Forum | Fri Aug 25 04:43:58 EDT 2017 | praveenmuthusamy

Thank you so much for your valuable feedback . Root cause was found that amount of solder paste printed on board is uneven. Uneven solder paste printing was Due to misalign of backup support pins in PRINTER. Problem was rectified after changing backu

Solder bath eruptions

Electronics Forum | Mon Mar 07 09:19:30 EST 2005 | patrickbruneel

Check your heater elements one or more are defective causing uneven heat distribution.

Uneven solder reflow

Electronics Forum | Thu Jan 18 07:30:13 EST 2007 | realchunks

It could be the blowers in cooling section of the oven. Try turning them off. It could be the belt is not level.

Re: Toombstone

Electronics Forum | Mon Nov 20 05:45:39 EST 2000 | Daniel Carlsson

Hi! Some varibles that I would think increase the risk: -The use of Nitrogen when soldering. -The use of IR may cause thermal vias (if placed only on one "side") to produce uneven heat distribution and thus wick the comp. -Uneven heat distribution.

Reflow oven exhaust down

Electronics Forum | Mon Feb 04 10:30:10 EST 2008 | tonyamenson

Well the profiler IS out for calibration so I can't use it. However, what piqued my curiosity is your statement concerning uneven heating. On the product we were running we had several non-liquidous solderjoints where as the rest of the joints looke

Re: Tombstoning of chip capacitors

Electronics Forum | Tue Aug 24 15:15:43 EDT 1999 | John Thorup

Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? Any help would be appreciated. Thanks. Most common reason is uneven heating where one side of the component ach

Tombstoning in Vapor Phase Process

Electronics Forum | Mon Feb 03 23:49:00 EST 2003 | Dreamsniper

Hi, Has anyone who's using vapor phase process able to help me troubleshoot tombstoning? I raed about uneven forces during reflow due to misalignment, pad design, paste volume deposition unevenness due to dirty stencils, worn stencil printer parts s

Solder balling under passives

Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch

Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 21:38:26 EST 2000 | Dave F

Mike: I'm with you. The only variable is the component. Look for corrosion, uneven plating, or crud on one of the end-caps. Good luck. Dave F

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