Electronics Forum: universal 6.0

Stencil for BGA re-balling

Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef

By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11

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