Electronics Forum: unwetting (Page 1 of 1)

Unwetting leads of Palladium Plated Pins

Electronics Forum | Mon Mar 01 11:03:51 EST 1999 | Dennis Xiong

Hello! SMT professionals, I do not know if anyone posted this question before. Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the heel side o

Unwetting leads of Palladium Plated Pins

Electronics Forum | Mon Mar 01 11:03:22 EST 1999 | Dennis Xiong

Hello! SMT professionals, I do not know if anyone posted this question before. Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the heel side o

Rejuvenated solder paste

Electronics Forum | Sat Dec 18 15:23:05 EST 2004 | grayman

We used to add flux on a "expired" solder paste but we discontinued as there are many problems and customers complaints coming from our American customer. Like unwetted solder pads,dull and cold solder and many others. The profit is really ok but qua

Re: Unwetting leads of Palladium Plated Pins

Electronics Forum | Mon Mar 01 12:50:47 EST 1999 | justin medernach

| Hello! SMT professionals, | | I do not know if anyone posted this question before. | Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the hee

Re: Unwetting leads of Palladium Plated Pins

Electronics Forum | Mon Mar 01 22:37:01 EST 1999 | Dave F

| Hello! SMT professionals, | | I do not know if anyone posted this question before. | Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the hee

ImSn thickness

Electronics Forum | Mon Feb 19 17:34:02 EST 2007 | GS

Thank You Pavel and Dave, Unfortunately I do not have IPC-4554. Anyway I 0.6-1.0umm is what I remember, and confirmed by reading also through leterature available on google. I was just going to understand if it possible to obtain more thickness

Re: Suspect BGAs

Electronics Forum | Wed Mar 17 17:14:49 EST 1999 | Michael Allen

Another test to consider is dye penetrant analysis. The technique involves flooding the area beneath the soldered part with dye (preferably a bright color, like red). After drying the board+dye in an oven, you peel or torque the part off and inspec

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