Electronics Forum | Fri May 28 16:03:10 EDT 1999 | Jeff Sanchez
| Has anyone had experience with prototype-scale, table top Placemax and/or Manncorp pick and place equipment? If so, what has been your experience with the machines? Are they reliable? Did they meet all your needs? Which needs didn't they fill?
Electronics Forum | Wed May 26 13:30:58 EDT 1999 | JohnW
| we have just started wave soldering passive SMT components and through hole. We are having trouble with voids on the SMT components. It is very random, but effects a lot of TSOT's. We are using an electrovert with a chip wave. Are there any obv
Electronics Forum | Wed May 26 14:24:13 EDT 1999 | Boca
| | we have just started wave soldering passive SMT components and through hole. We are having trouble with voids on the SMT components. It is very random, but effects a lot of TSOT's. We are using an electrovert with a chip wave. Are there any o
Electronics Forum | Tue May 25 11:31:57 EDT 1999 | Scott Cook
| | | | | | Any suggestions on how to maintain Adhesive dispensing nozzles??? They seem to plug up over night and it is starting to get on my nerves. We have tried leaving the nozzles in the machine, removing them and soaking in alcohol, blowing
Electronics Forum | Tue May 25 12:19:55 EDT 1999 | M Cox
| | | | | | | | | Any suggestions on how to maintain Adhesive dispensing nozzles??? They seem to plug up over night and it is starting to get on my nerves. We have tried leaving the nozzles in the machine, removing them and soaking in alcohol, bl
Electronics Forum | Wed Oct 03 17:10:32 EDT 2001 | davef
Your component is probably EPTSSOP [Exposed Pad Thin Shrink Small Outline Package]. We had a thread on EPTSSOP a couple of months ago. [Check the fine SMTnet Archives for background.] You�re correct that voids in the solder on the exposed pad [rea
Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F
| We care currently running into problems during our plug via process: | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is
Electronics Forum | Wed May 19 14:09:29 EDT 1999 | JohnW
Wendy, I've done this before using a machined piece of FR4 material to hold the board (machined like a DEK plate )in place at the press . It ensures that the boards are alway's in the right place and that none of the components are damaged..also sto
Electronics Forum | Tue May 18 14:47:02 EDT 1999 | Dave F
| Looking at the full convection reflow oven market, I see two segments, high mass heater ovens (i.e. Electrovert Omniflow,...), and low mass heater ovens (i.e. Heller,...) | Did some of you guys did some testing on both types and what were your find
Electronics Forum | Sun May 16 10:11:50 EDT 1999 | M Cox
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
