Electronics Forum | Tue Jun 14 07:29:12 EDT 2005 | jdumont
So I set up a board yesterday and did a test run. It appears that the spacing does matter on my machine. It placed the part off-center the same amount as one of the fiducials. Im going to look more into fixturing and placement pressure adjustments I
Electronics Forum | Thu Jun 23 05:54:38 EDT 2005 | Rob
Thanks Ajay, I've just rung them up & am awaiting a quote - I'll let you know. Cheers, Rob.
Electronics Forum | Wed Jun 15 10:42:52 EDT 2005 | Steve
There used to be a product simply called bean bags that you put on a pcb to keep components from lifting up during the wavesolder process. Any one know where I might find this product?
Electronics Forum | Thu Jun 23 09:11:45 EDT 2005 | russ
You should be fine with this if it is a plastic body, If it's ceramic or some other kind of heavy package you will probably want to check. We process PBGAs up to 35x35 with no glue on many occasions.
Electronics Forum | Wed Jul 06 12:25:55 EDT 2005 | HOSS
Bob, We have seen this same issue and haven't found a solution other than touching up to create a toe fillet. Luckily, it's a low volume product, for now. What have you done to combat this? Thanks.
Electronics Forum | Fri Jul 01 20:02:34 EDT 2005 | Tom B
1st Consider the time involved with upgrading and troubleshooting! Is it worth it? With prices of PC's near to nothing, it may prove cheaper and easier just to purchase new system! However, Your last Post mentioned mixing of 100 and 133 Rams! Unl
Electronics Forum | Tue Jun 28 10:41:57 EDT 2005 | GS
I am not an expert but just for my understanding: - solder paste used ? NC ? other ? - reflow in Air or N2 ? - temp ramp up before soack (�C/second) ? Tnks GS
Electronics Forum | Tue Jun 28 13:23:56 EDT 2005 | Bob Gilbert
Matt, Try a cooler profile by simply speeding up the conveyor by 10%. The difference may be the temperature the pads are reaching between the HASL boards and the Au boards. Are they the same thickness?
Electronics Forum | Tue Jul 05 20:27:54 EDT 2005 | Marcus
Having trouble identifying J-STD requirement on lead tinning. How far up to the cermaic package can you go?
Electronics Forum | Thu Jul 07 07:18:50 EDT 2005 | davef
Sounds like you need to turn-up the dial of your oven. Solderabilty protection finishes on components are changing, whether it makes sense or not.
