Electronics Forum | Mon Apr 07 17:08:09 EDT 2003 | jonfox
I remember an issue that we had with some SMD AEC's in the not too distant past. They had a thermal barrier that our reflow oven surpassed, not allowing us to run them through reflow. We ended up having to hand solder them in place post reflow. We
Electronics Forum | Wed Apr 09 14:09:54 EDT 2003 | davef
MA/NY DDave, I'll take your money. I'm betting on the Class II, whatever that is, because: * Solder is the same. * Board is the same from a fabrication and probably materials standpoint. * Components are the same. * Processing is the same. ... but
Electronics Forum | Wed Apr 16 08:43:00 EDT 2003 | davef
Given that the LED work properly after being touched-up and that you don't have problems with other components, you may not be wetting the LED termination solderability protection during your normal reflow. Use a profiler to check the temperature on
Electronics Forum | Tue Apr 22 11:02:42 EDT 2003 | k_h
I'll throw this out there also: http://picturecenter.kodak.com/share?invite=HE2r4mzhP5YLJkvkhU1o It shows void slots (purple) in the copper on the perimeter of the smaller transistors heat sink. Should keep the smaller transistor from moving while th
Electronics Forum | Tue Apr 22 13:05:01 EDT 2003 | Mr. B
I am curious on some opinions on cleaning of boards. We have a board wash but after the wash we still need to stem them for better cleaniness. The timed steaming is prox. 2 mins a side and by the way this is a medical board. So if you got and suggest
Electronics Forum | Tue May 06 12:01:47 EDT 2003 | davef
H2PO3^- + H2O + 2OH^-" is not balanced. It should be "3H2PO2^- => H2PO3^- + H2O + 2OH^- + 2P" tommyg_fla I'll respond your question, but I've got alligators up to here, and they're doing what alligators do.
Electronics Forum | Mon Apr 28 09:33:34 EDT 2003 | chrissieneale
This may be a really silly question but does anyone pick up and hand place the reject parts from the scrap bins of the machine? My attrition rates are out of control and i think this would not only highlight the problem but also save oodles of money
Electronics Forum | Thu Nov 06 16:26:38 EST 2003 | Rocky
I would just like to add that here at 3M we have worked with various equipment manufacturers in resolving issues of psa cover tape delamination due to higher tension feeders or adhesive build-up in collection bin type feeders. If anyone is interested
Electronics Forum | Wed Jul 16 09:55:05 EDT 2003 | swagner
To answer the first post after my initial response we haven't published any of our lead free data since it is proprietary, sorry. As for the nitrogen cabinet it has been proven that over time the Gold plating can build up a layer of oxides that can
Electronics Forum | Thu May 15 07:37:49 EDT 2003 | pteerink
Have seen similar circumstances a couple times. Possible causes: 1) PCB defect - remove the BGA and inspect/test the PCB for shorts. ( trace short, layer short etc ) 2) PCB defect that only shows up when the BGA is populated - a short somewhere o