Electronics Forum: up (Page 896 of 1179)

Camalot 1818

Electronics Forum | Wed Jul 30 10:56:33 EDT 2008 | adamcrum

Hiyo! My company just recieved a Camalot 1818 from a another company that we are now building boards for to speed up production for their stuff. As some of you may know, the older versions of this model AREN'T supported by speedline. I made a grown m

Removable Feeder labels from dymo/Brother type printers????

Electronics Forum | Fri Aug 15 22:05:04 EDT 2008 | proy

I am looking for a nice way to print labels, say 1/2"x1 1.5" which I can place on a feeder or IC tube and remove easily later. I am going to set up a laptop on a cart with a small printer and write scripts for my MRP database application so the opera

problem in solderability

Electronics Forum | Thu Aug 28 07:32:06 EDT 2008 | realchunks

I've been there. Soldering no lead parts in a leaded world can be difficult. Sounds like you are not wetting to your parts becasue you ar enot getting hot enough. Here's the trick - you can turn up your profile to look like a no-lead profile, and

problem in solderability

Electronics Forum | Thu Aug 28 11:15:05 EDT 2008 | omid_juve

I've been there. Soldering no lead parts in a > leaded world can be difficult. Sounds like you > are not wetting to your parts becasue you ar enot > getting hot enough. Here's the trick - you can > turn up your profile to look like a no-lead

no clean flux + wave soldering issue

Electronics Forum | Thu Aug 28 09:30:20 EDT 2008 | patrickbruneel

Omid, No-clean fluxes need to be used right out of the can without thinning. In the past with RA and RMA fluxes you could adjust or thin them to your desired density because they had plenty of solids up to 30%. No-Clean fluxes have a lot lower solid

power relay problems

Electronics Forum | Mon Sep 08 08:59:45 EDT 2008 | davef

You're correct: * Sealed relays should not be cracked or have moisture intrusion. * Hand soldering relays is going to be expensive. [Using a mini-solder pot for this might reduce some of the burden.] The good part is that the problem is gross enough

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Wed Sep 10 12:20:52 EDT 2008 | grics

True words of wisdom. Production managers need product out the door, not tied up in wip waiting on an analysis to go and fight a vendor for errors in their manufacturing. Especially if you are a Low Vol High Mix facility. Quite frankly, the resourc

New to SMT Equipment

Electronics Forum | Wed Sep 17 12:51:04 EDT 2008 | stepheniii

We got over 500,000 placements per month with two Mydatas for three consecutive months. And I want to say organized Fuji changeovers beat disorganized mydata changeovers. Even though Daxman is right that they can take a little longer to set up. In o

New to SMT Equipment

Electronics Forum | Wed Sep 17 21:27:30 EDT 2008 | dekhead

I'll put a vote on MyData, but you might have problems with the volume... If you're buying used on this better off buying from MyData, they have a tendency to buy up the decent stuff off the used market, and anything left noone really wants to deal w

SAC305 Lead Frame Component with Leaded Process?

Electronics Forum | Tue Sep 16 16:16:12 EDT 2008 | ck_the_flip

Yes, this scenario is fine. However, BGAs are a different story since the ball is the bulk of the solder joint. In this case, you MUST run a "hybrid profile". Look it up in the fine SMTNet archives (keyword: hybrid profile). I have "been there an


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