Electronics Forum | Thu Sep 10 17:38:30 EDT 1998 | Dave F
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Fri Sep 11 09:45:39 EDT 1998 | Earl Moon
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Thu Sep 10 16:50:50 EDT 1998 | Steve Schrader
| I have just been asked to do research into vibratory/belt feeders by my mangement. We are transistiioning into a more short run JIT environment for our captive products. My investigation has turned up two suppliers (USVibra, and Comtra Systems). D
Electronics Forum | Thu Sep 03 14:09:22 EDT 1998 | Matthew Park
Rich, From my experience, few causes of capacitor cracking are: - mechanical stress caused by pick'n place nozzles and chucks. Try to isolate and find cracked caps before boards go thru reflow or wavsoldering. - thermal stress by reflow pro
Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus
| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent
Electronics Forum | Tue Sep 01 09:11:19 EDT 1998 | Brian Stumm
A new book, Speed to Market: How to Cut Lead Time and Increase Profits in Job Shops and Custom Manufacturing Environments can be previewed at Speed to Market (http://members.aol.com/ddilink) Praise from readers: Speed to Market is one of those book
Electronics Forum | Tue Sep 01 20:36:05 EDT 1998 | Rin Or
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Tue Sep 01 19:31:36 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Tue Sep 01 09:02:24 EDT 1998 | Justin Medernach
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Wed Aug 26 11:00:41 EDT 1998 | SMTA Great Lakes Chapter
ATTENTION all Technetters located in/near the Chicago Area The SMTA Great Lakes Chapter is having a Mitsubishi Plant Tour and Golf Outing on September 4, 1998. AGENDA 9:00 a.m. Mitsubishi Plant Tour (Free, please register) 11:15 Check in at Four Wind
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