Electronics Forum: ups (Page 1036 of 1179)

Nitrogen Storage

Electronics Forum | Wed May 15 13:11:26 EDT 2002 | fmonette

Hi Dason, Yes I was talking about the same paper. This is the best technical information available to clearly explain the physics of moisture diffusion inside a plastic package. Many of the guidelines contained in the current J-STD-033 are derived

non-wetting

Electronics Forum | Wed May 22 21:01:49 EDT 2002 | davef

Ah, the customer is always correct, again. And you are officially �painted into a corner�. Actually, your customer is not correct. Thinking that money is going to be saved by specifying copper component terminations [or whatever in the world they

changing from no-clean to clean

Electronics Forum | Wed May 22 08:43:40 EDT 2002 | pjc

I have experience cleaning NC for military boards. The reason for cleaning the NC is due to conformal coating requirements. Zestron Vigon A200 and Atron AC 100, as well as Petroferm Hydrex DX have both been effective at cleaning Alpha UP78 NC paste.

Profiling board

Electronics Forum | Thu May 23 12:20:08 EDT 2002 | cyber_wolf

Well it depends on what kind of oven you have. If you have a short oven, you are going to have a difficult time. You will probably end up having several different profiles if that is the case. We have 3 BTU TRS 212 furnaces. They are fairly long 8 zo

Are US OEM Manufacturers Dead?

Electronics Forum | Tue Jun 04 04:43:50 EDT 2002 | ianchan

Hi mate, Been working in asia for past 6 years and this calls for alot of contact with asian based CM and customer groups. experience has shown the chinese group have strong "reverse engineering" talents and are liken to the early japanese "invento

Temporary Stencil for MPC555 PBGA

Electronics Forum | Thu May 30 13:46:00 EDT 2002 | davef

Consider NOT getting involved in those little POS chunks of sheet metal. * They're expensive. * You never have the one you need. * Even if you DO have the item you need, you probably will not be able to locate it. * It's all but impossible to c

Polarity for SMT Devices

Electronics Forum | Tue May 28 21:00:59 EDT 2002 | davef

That is the rub here, isn�t it? For those posting, it�s easier [but much slower] to start a new thread than to search the archives. [And posters could view their issue so unique and novel that it could never have been discussed several years earlie

BGA Assembly

Electronics Forum | Thu May 30 10:59:41 EDT 2002 | Hussman69

Diamond/sqaure shapes are good for when you X-Ray the BGA as stated above. The only problem is if you you over print too much, you can get solder beading. I recommend round pads to avoid the beading and use X-Ray to make sure you reflow correctly.

gold connectors

Electronics Forum | Fri May 31 08:51:09 EDT 2002 | zanolli

Hello Dave, As related to connector mating interface, fretting corrosion is the oxidation of the contact points, causing high resistance across the interface. Fretting corrosion is caused my micromotions in the interface exposing the metalized conta

gold connectors

Electronics Forum | Fri May 31 17:04:02 EDT 2002 | davef

We use boots / shunts er wutt ever you call them to protect solderable component surfaces from wave soldering. Not sure how it would work in your case try: * Kinnarney Rubber 450 Main St. P.O.Box 37 Mantua, N.J. 08051 609-468-1320 fax 7438 http://ww


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