Electronics Forum | Mon Jul 05 03:44:53 EDT 2004 | johnwnz
Dave, I'm going to disagree with you on the ENIG, it's my 3rd choice only just beating out OSP for that 4th spot. 1. Immersion Silver - cheaper than ENIG, as flat and no issues with Brittle interface (black pad) or Gold Embrittlement) Longer shelf l
Electronics Forum | Thu Jun 24 14:34:13 EDT 2004 | tjensen
There are many factors that can lead to solder balls. Since you have just recently seen this start to occur, it is obvious something has changed in the product or your process. Since we don't have a lot of details about your process, I would sugges
Electronics Forum | Fri Jul 16 13:41:24 EDT 2004 | Frank
I agree with everybody here. There are plenty of better options than what you have proposed. Without knowing your equipment brand, or what type of offline software you have, if any, I have a few suggestions. 1) If you don't have any offline softwa
Electronics Forum | Fri Aug 13 19:49:38 EDT 2004 | Paul
Funny how these things are. I see more PACE equipment on the shelf and on EBAY. I've seen hundreds of the Zephyrtronics units in Raytheon myself...all being used and on very, very large boards. I believe that they actually have a far larger selection
Electronics Forum | Thu Jul 22 04:28:05 EDT 2004 | ouch
Hi, I'm new here, but I have a problem that I don't see discussed. I am trying to repair a Zilog Z80 Encore Board. these boards use 4 layers. you can see the board here on page 11: http://www.zilog.com/docs/z8encore/devtools/um0151.pdf I have bough
Electronics Forum | Tue Jul 27 06:04:16 EDT 2004 | cyber_wolf
Grant, I know of a couple places that throw their paste out at the end of the day. I have worked in SMT for over 15 years and we have never thrown paste out unless it was contaminated, or dried out. We have never had a problem. If you ask me, I would
Electronics Forum | Tue Aug 10 15:28:54 EDT 2004 | Shean Dalton
Because the HASL process most deal with bare metals, HASL flux residues are generally more active than solder paste residues. Typically a Rosin Active (RA) flux is used in the HASL process. These flux residues should be removed from the bare board
Electronics Forum | Fri Aug 06 08:38:25 EDT 2004 | Bob R.
You don't mention the board surface finish, but BGA's on NiAu are prone to brittle fracture in the Sn-Ni intermetallic on the board side of the joint. You may not be able to see it visually, but it would show up in a cross-section. In-circuit test
Electronics Forum | Wed Aug 18 00:53:16 EDT 2004 | Grant
Hi, I think you cannot go wrong with Convection. If you want to experiment with VP, just get some of the fluid and put it into a pasta cooker on a standard domestic hot plate. Have a basin full of cold water so after reflow you can lift the cooker a
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
