Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Mon Dec 11 05:30:11 EST 2006 | mika
[Drop down menus] > Machine > Configuration > Parameters > Axes => You are now on a page with 3 menus > on the left side menu [Axis choice] scroll down and mark [Transfer belts] > On the upper right menu [Configurable Values] > mark [Default maximum
Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Fri Dec 15 07:25:21 EST 2006 | kvanzill
Hello, I am seeing something new to me and I am hoping some one some where may have resolved this before. I am running a Panasonic SPF63 screen printer with Tamura (RMA-012-FPL) solder paste. Now this problem is hard to describe but I will do my bes
Electronics Forum | Tue Dec 19 20:54:52 EST 2006 | Guest
Your experience is quite different than mine. At continues dispensing,I noticed that glue dispense volume increase as the material in the syringe decrease. My machine is using air time pressure pump. This is normal for this kind of pump since ai
Electronics Forum | Sat Dec 30 19:02:19 EST 2006 | mika
This type of component packages works best with vision type: 254 - irregular. Measure the total package length including the leads. Also set the body dimension x-y tolerances to at least 0.35mm and the the pick up x-y tolerences to 0.5mm in the part
Electronics Forum | Thu Jan 04 08:33:08 EST 2007 | davef
You cannot determine foil thickness from its weight per area, because of the significant variation in the density of electrodeposited [ED] copper. But people don't care. They do it regardless. (oz/ft2)||(mils)||(mm) 1/2||0.7||17.8 1||1.4||35.6 2||2
Electronics Forum | Tue Jan 02 16:49:14 EST 2007 | dyoungquist
I am looking for data on the yield of printed circuit board assemblies so that I can judge if our SMT line is performing up to typical industry standards. Following I will describe the details of the assembly and what our yield has been. Each board
Electronics Forum | Wed Jan 10 20:06:43 EST 2007 | SSS
I've been assembling thousands of boards for dozens of customers over the past 5 years with 0402 chip components. 85% can happen very easily even with newer equipment. Defect challanges with 0402 packages is almost always tombstoning. Capacitors abou
Electronics Forum | Wed Jan 24 11:24:07 EST 2007 | ruggi
I'm probably not telling you anything you don't already know, but a technique that's worked very well in the past for me is to methodically step through every part of the process and observe your boards being built, or take a scrap or simulated one a
