Electronics Forum | Tue Jun 30 12:06:04 EDT 1998 | Michael Fogel
| | I have a 2-up panel measuring about 8" x 8" with a score for depanel throuch the middle. I see warping after reflow of the panel (bending in/about score line). The board is not framed (i.e., supported) during SMT reflow other than on the conveyor
Electronics Forum | Tue Jun 16 22:25:15 EDT 1998 | Ben Salisbury
A while back I had mentioned hosting an ICQ chat room, my computer at home has since puked itself and I haven't yet convinced my company into letting me run ICQ over their network. So When and if I get the funds to replace my computer at home, the R
Electronics Forum | Mon Oct 01 02:51:24 EDT 2001 | haran
What is the main problem in running Mictor connector in SMT? What should be the stencil opening for the through hole lead?Is there any way we can eliminate touch up for the through hole lead as I understand from others that the main problem in runnin
Electronics Forum | Mon Jun 01 19:04:45 EDT 1998 | Chris
I run about forty different boards ranging from single to double sided & from 0603 to 324 PBGA. 2> The placement rate is around your spec. 3> And depending on the table arrangement you can get up to & above your feeder needs including several soic vi
Electronics Forum | Thu May 28 08:39:13 EDT 1998 | Rob Williams
I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not able
Electronics Forum | Thu May 28 08:38:43 EDT 1998 | Rob Williams
I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not able
Electronics Forum | Thu May 21 18:54:36 EDT 1998 | Dave F
Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recently tol
Electronics Forum | Wed May 20 08:38:51 EDT 1998 | Jerry
We have had really good luck with the IIT version. We use it with a DEK265 also. I am having trouble coming up with a brochure but their email address is iit@ns.net. We have ordered probably 10 to 15 stencils for use on prototype builds. We have
Electronics Forum | Mon Jun 08 08:49:14 EDT 1998 | Michael
| Does anyone have a phone number for Topline. I am looking for some dummy components, qfp132s specifically, and their website seems dead and the only number I hve for them is disconnected. | Thanks, Gary Gary, Just a quick note, TopLine filed cha
Electronics Forum | Wed May 13 14:22:17 EDT 1998 | JoSi
Hi, There has been a lot of disputes in our company about changing present HASL to another Finishing which can provide more flatter pad surface in fine pitch applications. ( perhaps Ni/Au, OSP ) The target is to reduce solder defects, thus improve
