Electronics Forum | Tue Feb 25 23:17:12 EST 2003 | MA/NY DDave
Hi Up above in his operation / process description after a call to Locktite and then my note and then your note, we may have found the problem. One never knows at a distance. It appears he is striving to do soldering/reflow first and then concurren
Electronics Forum | Mon Feb 24 13:17:59 EST 2003 | Stephen
Air is non-conductive, and it is moving. Not only is it moving, it is moving against something else i.e. the hose. Anytime you have movement (friction) between two dissimilar non-conductive "things" you have the possibility of static build-up. This
Electronics Forum | Sun Mar 16 20:54:04 EST 2003 | MA/NY DDave
Hi Well you got lucky with this note series. See the abbreviations Steve gave in the note above yours. Then go to my note up earlier and click on the web site I listed. Then go to the Buyers guide and you will see two of the choices are "Steve's a
Electronics Forum | Tue Mar 04 15:46:00 EST 2003 | EW
I'm not sure to what degree you are manually crunching this data.....If you can set up the data manually, or parse the data from a recording function, to allow it to import into a database with a formula for Cpk, and everything else you could ever in
Electronics Forum | Wed Mar 05 13:12:33 EST 2003 | msivigny
Hello davide, the biggest advantage you'll find with a complete N2 tunnel is the minimization of oxidation during board preheating. Using only an inerted solder pot allows the oxidation to build up throughout the preheat stages and introduces contami
Electronics Forum | Mon Mar 10 16:29:09 EST 2003 | julief2000
Kevin, The Technical Devices Machine, the EVS is a stand alone system that can reclaim up to 75% of the dross weight as usable solder. It has a much more proven history than the Electrovert add on, as well as being lower priced. The Technical Devi
Electronics Forum | Tue Mar 11 11:22:38 EST 2003 | slthomas
Is a water-soluble flux based paste an option for the bottom side? Then you could wash the residues from the board before wave. That's the only way we've tried that process. The difficulty we had was with some disturbed joints, apparently from s
Electronics Forum | Wed Mar 12 09:23:56 EST 2003 | MA/NY DDave
Hi I don't see in your note any particular reasons why you couldn't. If it solders well and passes what ever specifications you are using than everything is OK. If your repair faces some soldering or rework challenges where a more agressive flux is
Electronics Forum | Mon Apr 07 17:08:09 EDT 2003 | jonfox
I remember an issue that we had with some SMD AEC's in the not too distant past. They had a thermal barrier that our reflow oven surpassed, not allowing us to run them through reflow. We ended up having to hand solder them in place post reflow. We
Electronics Forum | Wed Apr 09 14:09:54 EDT 2003 | davef
MA/NY DDave, I'll take your money. I'm betting on the Class II, whatever that is, because: * Solder is the same. * Board is the same from a fabrication and probably materials standpoint. * Components are the same. * Processing is the same. ... but
