Electronics Forum | Tue Apr 29 02:48:18 EDT 2003 | chrissieneale
Thanks for your replies guys, i definately will look into the retapeding option as on further inspection of the line yesterday i found that some of the reels have a crappy plastic on top of them that our feeder literally just pulls off, exposing lots
Electronics Forum | Fri May 09 10:29:23 EDT 2003 | k_h
72 different part numbers, 53 being 8mm, remainder being 12-44mm and 3 tray. It may be low but anymore than 100 and you give up throughput because of feeder locations. And thinking about it, 70-90 is low for a low volume high mix line. I guess if I w
Electronics Forum | Mon May 12 10:14:04 EDT 2003 | gregp
Hello Stefan, Thank you for your reply. I see now that manufacturers are aware that this kind of thought process is necessary for the bottom line profit. It is also true that one can be "seconds wise and minutes foolish" in the process. I read with
Electronics Forum | Wed May 07 08:10:22 EDT 2003 | Pon
Hi all Are there any advice pls. let me know. Our customer Void spec. at BGA and CSP is less than 10%. Usually we found void defect at BGA and CSP component around 2-3 % but sone lot the defect rate is up to 18%. I have read some input from this w
Electronics Forum | Thu May 08 09:00:03 EDT 2003 | stefwitt
I like to find out more about your feeder manufacturer. Known problems: If the cover tape peel back is located in the pick up window, the tape may lift the component out of the pocket and when the component falls back it could be inverted. The co
Electronics Forum | Tue May 20 11:09:30 EDT 2003 | JB
Hello Gav, We have tried the procedure that you described, and it didn't work well for us. Even though the viton tubing is doubled up and pinched, no amount of glue is visible at the tip of the tubing. So getting the glue to protrude from the syring
Electronics Forum | Tue Jun 03 13:01:16 EDT 2003 | Ramanandkini
We have some experience in manual application of conformal coating using a brush that too for small circuits espceially on the soldered pads. We use Chase corporation's Humuseal 2A64. This passes high humidity tests. I am also in touch with Lackwere
Electronics Forum | Fri May 30 18:57:44 EDT 2003 | russ
We place a large amount of .4mm (what is that in microns?)QFPs every day. I would much prefer a BGA package. Reasons are 1. Pitch is greater which provides a larger process window 2. Alignment is easier because you don't need vision for BGA if you
Electronics Forum | Tue Jun 10 18:54:12 EDT 2003 | fastek
Sorry guys. I'm not in agreement with your nightmarish vision of a Matrix based future. As a guy who has worked in the trenches since the 70's myself....I would say that anything that replaces humans in this business is a good thing. I've seen the ev
Electronics Forum | Thu May 06 19:56:30 EDT 2004 | bruceatknoll
Here is some more info with regarding my Wave. 1. PCB .065" thick 2. leed length .20" (.135" protrution) I know this is high but we use many thousands and cutting each is not practical. 3. no clean flux by way of foam fluxer 4. wave machine is a HOL
