Electronics Forum | Thu Jan 20 07:58:46 EST 2011 | jdengler
Hi Bert, Take all feeders off of the machine. Do a reset start (hold reset switch in while powering up the machine). This will flush the memory so you will need to load PROPER, STATUS, PROGRAM. If it still does it you may have a short in a feede
Electronics Forum | Sun Jan 23 00:57:23 EST 2011 | bvdb
Hi Jerry, Happy New Year. Thanks for your suggestions. You were on the right track because I remembered that one of the last things that happened before the error message started showing up was that I cut and removed the empty tape from the back o
Electronics Forum | Mon Jan 31 11:28:51 EST 2011 | krisroberson
You stated that you are producing Class 3 boards so I assume you are familiar with the IPC standards.To answer your question directly, I'll refer you back to the J-STD-001. Clause 12.1 states "12.1 Rework Hardware defects shall [N1N2D3] be documented
Electronics Forum | Thu Aug 04 09:27:25 EDT 2011 | rway
Software, software, software. It always seems to be related to any hardware issues we experience with our systems. Can you expound on "crash?" How does the software crash, what are the symptoms. Does it just lock up and become unresponsive, camer
Electronics Forum | Tue Feb 15 00:27:39 EST 2011 | jeffr
First clean and de-bur the hole in the nozzle, then try it again. If the Head does not pick up at the feeder, then moves to the dump position...it means that the Vacuum Sensor Board has detected that the nozzle vacuum is above the LOW threshold setti
Electronics Forum | Mon Mar 07 22:40:36 EST 2011 | sarason
I have written an SMT file generator available at http://users.tpg.com.au/sarason/index.html try the YM6021 generator output option, it is very similar to a CSM66 file. The YMxx series file is a little different in format. This should help your file
Electronics Forum | Fri Mar 04 18:28:21 EST 2011 | hegemon
First, I would inspect for lack of solder bridges from the center slug to the outside leads. I would then look for evidence that the solder paste has reflowed beneath the component, without leaving too much void percentage. Typically we allow up
Electronics Forum | Wed Feb 23 03:12:25 EST 2011 | pkannan
You are very right. There are 2 major factors 1) There is going to be Flux separation. This is basically due to fact that metal particles are heavier than the Flux vehicle system, and due to gravity effect they slowly drift downwards leaving the ligh
Electronics Forum | Wed Feb 23 03:22:47 EST 2011 | pkannan
(Corrected the Subject line - sorry for Spelling ) You are very right. There are 2 major factors 1) There is going to be Flux separation. This is basically due to fact that metal particles are heavier than the Flux vehicle system, and due to gravity
Electronics Forum | Thu Feb 24 22:32:56 EST 2011 | rstadem
PKannan, Your opinion is contrary to J-STD-005 "Requirements for Soldering Paste". Within that document is included specific requirements for re-certification of expired solder paste. Paste that is expired can be used after a simple viscosity test an
