Electronics Forum | Wed Jun 27 21:33:09 EDT 2001 | davef
There was a similar thread last week on SMTnet. Maybe the poster of that thread can help. Not everyone responds on-line. Check the SMTnet Archives for generalities and platitudes about PIH, although there may be some good links. Baring the obviou
Electronics Forum | Thu Jun 28 10:58:28 EDT 2001 | brownsj
The question is are you talking of a reflow or wavesolder process. If your talking reflow I used to use a stepped stencil to ensure I had sufficient paste and then make a double pass with my squeegees. First pass with a 45 degree rubber squeegee to f
Electronics Forum | Sat Jun 30 04:43:09 EDT 2001 | brendan
Hello We introduced OSP finish on some of our products but now need to add some discretes at the end of the process. From my little knowledge of OSP, this is difficult. We'll SMT the boards and transfer them to another site for further processing.
Electronics Forum | Tue Jul 03 11:56:13 EDT 2001 | Russ Roberts
I am a Manufacturing Engineer working on a new bid. Please help with my question about a new process that I am unfamiliar with: The Assy that we are quoting involves a SMT PCA that is soldered to an aluminum chassis. All surfaces of the chassis that
Electronics Forum | Wed Jul 11 20:24:00 EDT 2001 | davef
Well, your wipes are a good first step in removing the bulk of the material, but they do little or nothing to remove the material from the apertures. * It would probably be cheaper to use poly stencils and then throw them away after each use, eh? ;
Electronics Forum | Wed Jul 18 11:19:58 EDT 2001 | genny
I didn't wade thru all of the info you presented above, but your comment about ampacity of printed circuit boards brought to mind a copy of an article I keep in my files. Luckily I photocopied the whole page from the magazine and can actually tell y
Electronics Forum | Thu Jul 26 17:38:02 EDT 2001 | Russ Cutler
We are looking into using Scored PWB's on a new high volume design. We've used Tab Routed PWB's exclusively in the past. I understand that Scored PWB's are more efficient to produce and depanelize. Question: What are the industry standards for cr
Electronics Forum | Mon Jul 30 18:07:22 EDT 2001 | mparker
Kenny- there are a few standards by IPC and EIA that address the strength of solder. A pull test (which is a destructive test) will average 1500 PSI per joint. My concern is that you are wanting to increase solder volume for an 0805 component by inc
Electronics Forum | Mon Jul 30 21:29:34 EDT 2001 | kennyhktan
Hello Michael & All, Thanks for the feedback. Months ago we receive a number of reject concerning one of the 0805 & 0603 chip capacitor mising (with joint remain on pad)and seriously solder joint fracture. From there I had do some investigation
Electronics Forum | Mon Jul 30 21:31:19 EDT 2001 | kennyhktan
Kenny- there are a few standards by IPC and EIA > that address the strength of solder. A pull test > (which is a destructive test) will average 1500 > PSI per joint. > > My concern is that you are > wanting to increase solder volume for an 0805
