Electronics Forum | Fri Aug 03 19:03:32 EDT 2001 | seand
Hello John, What is the key reason requiring that this unknown material be injected from below vs. dispensed prior to placement. Is it an issue with reflow temperatures, effect on placement/thermal expansion? Is this a true requirement or specul
Electronics Forum | Fri Aug 03 22:36:28 EDT 2001 | mugen
We used Thermal Pads, made of black rubbery material, and sticky on both sides (like x2 side tape), intent is to place in between, BGA/QFP and the PCB board, and reduce the air-gap flow between, the PCB to SMD... air-gap will permit air flow, that i
Electronics Forum | Sun Feb 06 15:26:32 EST 2000 | Carol Zhang
I have a board which contains brass spacers. The spacers will pass through the wave during soldering. I found a silicon-rubber cap that can prevent solder climbing up into the spacer. However, the cap influence the wave flow and reduce the solderabil
Electronics Forum | Sat Feb 05 12:36:09 EST 2000 | Albert Hay
Hello everyone, I am cosidering the possibility of using Low-Melt solder for repair purposes. However, I am concerned about adding a new alloy (agent) to the board that already has the No-Clean solder on it. Also, is the Bismuth in the Low-Melt comat
Electronics Forum | Fri Feb 04 11:55:08 EST 2000 | Casimir Budzinski
I am looking for a faster way to trim component leads after wave solder. We now cut by hand, we have a Q-cuter but stoped using it the blades dulled quickly and left flags. we just got a cut and clinch locator and hope this will solve some of are pro
Electronics Forum | Thu Feb 03 16:51:54 EST 2000 | Doug Philbrick
I have used a PDR I.R. machine for BGA repair and I personally liked it. The two big features I liked were no special tooling and it has a IR temp probe that is closed loop and will keep the temp where you programmed it. The vision allignment works w
Electronics Forum | Fri Feb 04 11:26:58 EST 2000 | Lisa Anderson
We are currently using an Air-Vac DRS24 hot air BGA/SMD rework unit. Most of our nozzles are designed to channel the exhaust away from nearby components. This and a minimum keepout of .100" has prevented any issues with secondary reflow of those co
Electronics Forum | Thu Feb 03 06:21:57 EST 2000 | Ignacio Simon
I would like to have information about the materials commonly used for laminates of printed circuit boards, their main thermal, mechanical, humidity and electrical characteristics and proper finishing and aplicattions, and advantages/disadvantages be
Electronics Forum | Tue Feb 01 18:29:03 EST 2000 | Roland
Gary, You may have luck by posting this info in our PCB Capital Equipment Mart-wanted section. The Mart also contains a large listing of equipment. Please also take note that we have a few used equipment dealers as advertisers whom you may want to
Electronics Forum | Fri Jan 28 10:09:50 EST 2000 | mike d
Istvan, One possible reason for this is that you are using a water soluble flux in your wave solder machine. If you are and the boards are not pre heated long enough, the water in the flux does not evaporate before hitting the wave. When the water
