Electronics Forum: use (Page 1231 of 2487)

any experience with the heller 988

Electronics Forum | Tue Nov 16 09:51:25 EST 1999 | greg

has anyone used the small heller 988 reflow? If so what is your opinion of this machine.. is it comperable to the larger heller with a slower rate? i am looking for a small straight forward reflow for a thin, single sided project but i will dedica

Re: SOT-223

Electronics Forum | Tue Nov 16 14:19:09 EST 1999 | JAX

Larry, Bubba's correct. He is probably just reading it off of a jedec spec sheet. Of course it really depends on what machine you are using when pin one is being determined. Not that it matters, it should still only come in the T/R package one di

Re: Breaking scored boards, breaking components.

Electronics Forum | Tue Nov 09 11:50:33 EST 1999 | Steve Owen Snr prod eng.

We have recently purchased equipment that would probably solve your problem. We are using 1.6mm pcb material 1/3 of which is left unscored. When the pcb is de-panelized there is no damage to any components and we have cut our break time in half.

Re: mixed technology

Electronics Forum | Wed Nov 03 10:10:05 EST 1999 | John Thorup

This has come up a number of times recently and a search for intrusive reflow or pin in hole reflow will reveal several threads. Also a good resource is the link below. From what has been stated on many of these forums and my own pre-production tes

Re: Processing GIL MC5/0.035 Finished Thickness

Electronics Forum | Tue Nov 02 09:29:21 EST 1999 | Wolfgang Busko

Hi Kevin, you could use a fixture for supporting the assembly. I think it�s a common solution for thin PCBs. For the design you could search the archive there are some tips on this already ( search for support, fixture, pallet ). hope this helps Wo

Re: 0603 Solder Beads

Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper

Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot

Re: Double sided smt

Electronics Forum | Sun Oct 31 23:58:54 EST 1999 | John A.

Do both sides of that board contain larger IC's and other large components or just one side?? If just one side contains large components, try running the side with the smaller components first, and then run the other side last. If that doesn't work

non-wetting on gold land pad

Electronics Forum | Wed Oct 27 19:50:59 EDT 1999 | chris

Hi What is the possible cause of non-wetting of solder paste to the gold land pad. What we observed in the surface of the non-wet pad is an organic FM, and using FTIR we found out that it is a flux. It is possible that the cause of non-wetting is

Re: Press for press fit connectors

Electronics Forum | Mon Oct 25 19:29:12 EDT 1999 | g cronin

hi mario there is a company called motion automated that makes a nifty press, i have one in my shop that i have used for a while. well built and they have been able to make me custom tooling as well at reasonable prices. i'm going to try to dig u

Re: Gold Immersion - Soft Joints

Electronics Forum | Mon Oct 25 16:35:04 EDT 1999 | William

I am pretty sure I am not having a problem w/porous gold or nickel that does not solder. How about electroless versus electrolytic? I thought electrolytic was for goldfingers and such applications. Can you use electrolytic plating for fine pitch a


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