Electronics Forum | Mon Apr 05 17:47:21 EDT 2010 | boardhouse
Hi Deni, X-ray will not be able to see through Power and Grn planes. Your only way to find out is: 1) ask your board supplier to supply stack up used. 2) surface grind layer by layer to validate if it is correct stack up. What is making you think
Electronics Forum | Fri Apr 09 20:47:36 EDT 2010 | 89jeong
I think the oxidation on the pad happens easily but do not on Au plated pad.The reason may be caused by improper cleaning or Au plating thickness in plating process. But,before suspecting the pcb board, you need to check your process or used material
Electronics Forum | Wed Apr 14 10:24:17 EDT 2010 | fönsi
Hello Does somebody of you have some experiences with ultrasonic detectors in SMT-Production? Is it possible to test quality of solder joints by using a ultrasonic detector similar to non destrucitve crack inspection tests? Is there a manufacturer fo
Electronics Forum | Wed Apr 14 14:51:10 EDT 2010 | jgalarza
After checking some of our stencil data for the correct aspect ratio I found that a few are wrong. I would like to change them from 5mil thk to 4mil thk but do not know how much paste volume I need to keep. We are using 0201,0402, and BGA with 0.80 p
Electronics Forum | Thu Apr 15 10:09:55 EDT 2010 | davef
Dross formation rates for SnCu and SAC are roughly 2.5 times the rate for SnPb (Hwang et al., 2004) Methods for reducing dross are: * Lower pot temperature * Run pump speed slower and only when soldering * Check solder contaminants to BS219, ASTM
Electronics Forum | Thu Apr 22 09:57:11 EDT 2010 | davef
Ralph Woodgate is the 'god of wave soldering process control.' We believe he is now retired, but in olden times his presentations at SMTA meetings were 'DO NOT MISS.' We imagine you can find his books on the used book market. Look here: http://use
Electronics Forum | Fri Apr 16 12:23:40 EDT 2010 | shawnvike
We are looking at buying a new (or used) oven for low-mid volume Pb-free production. I have looked at the smaller Hellers, BTU, vitronics, etc. and I am also looking at the Manncorp CR-6000. I want at elast 5 zones, top and bottom, air (no N2) pi
Electronics Forum | Mon Apr 26 14:40:07 EDT 2010 | blnorman
We had one product that used immersion silver plating. There were a couple of instances where we saw tarnishing, and elemental analysis confirmed the presence of sulfur. These boards did have the anti-tarnish sheets between boards, but somehow they
Electronics Forum | Mon Apr 26 09:18:15 EDT 2010 | sudhir14
Hi, friends Need your urgent help on bellow issue ....... we are facing issue of misalign of one bulky SMT transformer during the placement itself rejection @40% & after reflow rejection @5 % using SMT m/c QP242 , placing this component at end of al
Electronics Forum | Fri Apr 30 00:20:33 EDT 2010 | sudhir14
We are using QP fuzi m/c during the placement of comp. PCB is fixed & placement head is movable This component is placed at last but still we are getting the problem Comp. is placed with slowest setting also slowest comp. transfer speed of nozzle h
