Electronics Forum | Fri Jun 15 08:00:08 EDT 2012 | deanm
ENIAC, 0.040" equates to 1mm, not 0.1mm. 0.040" is the IPC minimum recommended fiducial size and when we started putting fiducials on our boards I assumed that all equipment manufacturers should be able to automatically spot that size. Since then I'v
Electronics Forum | Mon Jun 18 22:08:45 EDT 2012 | bigvern
Hi, we are trying to locate some parts for a DEHAART semi auto printer, if anyone has any old spares machine, please advise. Have tried most of the phones numbers on this forum in regards to dehaart but all numbers are no use due to dehaart being fi
Electronics Forum | Wed Jun 20 21:07:25 EDT 2012 | bigboy
Have a look at AOI Systems Scanspection AOI. The desk top unit is very affordable, easy to use, and a very effective tool for new users to AOI. Visit http://www.aoisystems.com for more information or send me a PM and I will be happy to talk with yo
Electronics Forum | Thu Jun 21 12:18:47 EDT 2012 | swag
We use Hilman rollers (Hilmanrollers-mf.com) and/or pallet jacks. Printers and smaller P&P machines can be moved with pallet jacks. Large machines such as chipshooters require rollers and man power but you'd be amazed what you can push around on Hi
Electronics Forum | Fri Jun 22 20:20:24 EDT 2012 | hegemon
Is this a new process or are you experiencing a change in results from an already established process? We have KISS Slective Soldering (2 machines)and we do not have these issues, but we are not doing NC either, we are fully aqueous, using Nitrogen
Electronics Forum | Thu Jun 28 09:57:50 EDT 2012 | mosborne1
blow holes and via holes are almost always caused by moisture and in PTH they could be moisture and improper drilled holes. If you are seeing solder balls next to the parts than I would say you have a reflow profile problem. Are you using any kind of
Electronics Forum | Thu Jun 28 16:02:05 EDT 2012 | allwave
We had a similar problem with foam in our inline cleaner (TD). The problem were the solder paste flux residues. Boards went straight from SMT to Wave process and then washed. Anyway we changed the solder paste and problem solved. Are you using saponi
Electronics Forum | Fri Jul 06 10:45:02 EDT 2012 | ashworth14
In relation to question 2 the vacume on them is quite sensitive so as long as you bring it down slowly the component is almost sucked up off the PCB so you don't have to actually press it down on the the component, and i have never experienced any so
Electronics Forum | Fri Jun 29 15:35:32 EDT 2012 | gnus
The stencil doesn't seem to match the pcb. On the pcb there seems to be pads that are wider than others whereas the openings in the stencil seems to be uniform. As Phil mentioned, make sure the gerbers match the stencil. As for no fiducials, that sho
Electronics Forum | Mon Jul 02 16:05:54 EDT 2012 | stentech
using fids instead of pads I agree would be more accurate. However if the board and stencil do not register then nothing will align. We have started to fo many stencil to board matching due to board distortion either before or during production. We a
