Electronics Forum | Fri Jun 09 17:45:05 EDT 2006 | mika
We have some problem with the Pb-free SOIC's at the UIC GSM2 on the Flexjet head camera; (seem to remember this from before, but I can't find it on this forum). The Pb-free small SOIC:s are reflecting the light differently than leaded parts and are
Electronics Forum | Thu Jun 29 17:38:51 EDT 2006 | flipit
I might be wrong since I don't know this piece of equipment but I think ROL might be a better measure. For 63/37 it used to be 20 ppm ROL (residual oxygen level) was about what you needed for a reflow oven. This is to take full advantage of all tha
Electronics Forum | Thu Aug 17 09:38:28 EDT 2006 | pjc
Having the last two zones at the reflow temp (spike) is typically done on long ovens (10 zone) running at high conveyor speeds. This enables you to achieve peak temp and TAL as per the solderpaste specs at high production rates. Concerning reverse sp
Electronics Forum | Fri Sep 15 14:48:31 EDT 2006 | russ
we do get many strips kitted to us on floor, tough one to really handle but we do something like this, if the strip has 20 parts left on it, we usually chuck it, unless e know that the next build will use 10 or something and we can get it onto feede
Electronics Forum | Thu Oct 26 10:29:03 EDT 2006 | Mike
First, Voiding under thermal pad is unavoidable(pardon the pun), unless you can find a way to add sufficient amount of solder paste to cover the area, and match that solder volume on your terminal leads. I build HVM qty's of "QFN" components w/ therm
Electronics Forum | Mon Oct 09 07:50:22 EDT 2006 | quad
We currently run two Quad IVC's (we are very pleased with them) and two Versatronics for simple small volume batch work. We now need an additional machine capable of placing components at least three times as quickly as a IVC. We don't do anything ve
Electronics Forum | Tue Nov 14 18:38:59 EST 2006 | Brandon
Hello all, I am having an issue with some boards on our Wave Solder. It is a Pb free wave and These particular boards are exibiting A LOT of what I call solder bubbles in the larger than usual vias and un-used thru holes. Settings: 4 inch/min 144c to
Electronics Forum | Fri Dec 08 02:40:45 EST 2006 | Mike Konrad
Hi 'K', We manufacture both batch and inline defluxing equipment so we have no axe to grind with either technology. There are pros and cons associated with both technologies under specific conditions. Batch machines are typically good cleaners but
Electronics Forum | Tue Dec 19 20:54:52 EST 2006 | Guest
Your experience is quite different than mine. At continues dispensing,I noticed that glue dispense volume increase as the material in the syringe decrease. My machine is using air time pressure pump. This is normal for this kind of pump since ai
Electronics Forum | Thu Jan 04 15:39:07 EST 2007 | dyoungquist
While the 85% yield on a per board basis seems low, we are actually running over 99% yield on a per solder joint basis as there are about 17,700 joints per panel. On average, 9 out of 63 boards in the panel need rework. Rework issues include missin
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