Electronics Forum: use (Page 1706 of 2487)

Please HELP! TO220 Lead Forming

Electronics Forum | Tue Mar 25 11:32:15 EST 2003 | MA/NY DDave

Hi Kevin, Well I or we, used to do this all the time in PiH or THT days with some small hand forming tools (dies) and also some automated ones. You already have gotten the phone numbers for a couple of the small electronic assembly hand tools place

Solder paste change

Electronics Forum | Mon Mar 31 01:11:14 EST 2003 | yukim

Hi, we are about to change solder paste for cost issue. Currently using a no clean Sn63 solder paste and tried several others, all no clean, Sn63 and Sn62. Want to ask about reliability test: we did thermal shock test for 8 days. The flux residue cha

Solder paste change

Electronics Forum | Mon Apr 07 13:26:25 EDT 2003 | billschreiber

Dear Yukim, You may want to make sure that your presolder cleaning processes will support the change to a new flux. Many chemistries are vertically oriented and will clean only a selected few types of solder pastes. If you find that a new cleaning

0402 Adhesive Screen Printing

Electronics Forum | Tue Apr 01 11:18:47 EST 2003 | cyber_wolf

Is anyone out there successfully screen-printing SMD adhesive on an 0402 layout? We have successfully done 0603 and larger, but the deposition consistency on the 0402's is just not there. We don't always get enough epoxy on the board. We have tried a

BGA Picture Evaluation

Electronics Forum | Fri Apr 11 13:59:06 EDT 2003 | MA/NY DDave

Hi Wow, Quite elaborate. My Mechancial Engineering, Thermo friends would be proud of you. I am not kidding. The only problem I have with your technique is that quite often internal lands and structures steal the heat during soldering. By your techn

BGA Picture Evaluation

Electronics Forum | Fri Apr 11 16:07:08 EDT 2003 | daanterstegge

I'd say your profile is about right, assuming these are values that you measured in the balls of this BGA and not elsewhere on the board. If you want a more shiny joint than use a nitrogen oven or experiment with various solder pastes, but why the he

BGA Rework

Electronics Forum | Mon Apr 28 04:07:09 EDT 2003 | chrissieneale

The BGA rework process has been qualified for space flight. Which basically means someone sensible over in ESA has been replacing BGA's and life testing them. I agree the best way is to build clean boards without any mistakes, but i can honestly say

BGA Rework

Electronics Forum | Thu May 08 10:43:03 EDT 2003 | stimpy

Nice sugestions from all.. but one simple solution that you should practice from here on out.... CFM... If you would have built up your process, you would have found the flawes there early allowing you to correct the process flow. I would use CFM on

mirae pick and place machine

Electronics Forum | Mon Apr 14 12:33:14 EDT 2003 | Brian W.

In many cases, if you buy a used machine, it is worth the investment to register your machine with the manufacturer. That way you have access to support and information for your machine. A number of the machine manufacturers also refurbish their eq

Solder paste softener

Electronics Forum | Mon May 17 15:14:12 EDT 2004 | solderpro

Agree with Joe 100%, we recently brought one in from Malcolm for trial, this company had not practiced viscosity reading or anything in the process, the trail run was a great improvement in print, consistancy, deposition and formation of the solder b


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