Electronics Forum: use (Page 1721 of 2487)

Large Voids with Via in Pad

Electronics Forum | Mon Apr 12 08:10:17 EDT 2004 | wgaffubar

We are sometimes, not always, seeing very large voids in the solder joints of BGA's with Via in Pad. Some lots of PCB will have the voids and other lots of boards will not. I feel the via's are outgassing during reflow, due to the PCB not having been

Type 4 solder paste

Electronics Forum | Thu Apr 29 17:35:17 EDT 2004 | Shinmoto

Hi there, We place FBGA packages on a lot of our memory modules. Our stencils have .013" square apertures and a .005" foil thickness. We are using a type 4 paste from Senju Comtek. The price difference is not that significant and readily available

PSA 2668 Cover Tape on Fuji QP242s/QP351s

Electronics Forum | Tue Apr 13 18:57:57 EDT 2004 | TWegrzyn

Does anybody have any experience with PSA 2668 high shear cover tape on Fuji QP242s/QP351s feeders? Does it perform comparable to PSA 2666? We are looking to implement PSA 2668 due to some cover tape 'pop-off' issues with our Siemens HF machine, bu

Putting a center board support on lead free wave

Electronics Forum | Thu Apr 15 10:58:16 EDT 2004 | mwg9184

I am trying to put a center support on a wave solder machine for lead free soldering. My problem is that every metal I use is interacting with the lead-free metals and thus eating away the center support. I have tried titanium, stainless steel. I am

Thermocouple calibration on reflow oven

Electronics Forum | Thu Apr 15 16:33:40 EDT 2004 | wgaffubar

We never really use to calibrate the thermocouples on our reflow oven or wave solder systems, but we did disconnect the T/C's and input a calibration standard to check that the computer cards were correctly reading the proper temperature for a given

qfp reflow problems

Electronics Forum | Thu Apr 15 16:07:37 EDT 2004 | barry

Hi there all, we are having problems with 2 qfp devices. grainy poorly reflowed solder joints. One 100 pin .5mm pitch, and one 64 pin .5 mm pitch . Both of these devices have a thermo pad on the back of them (pad area soldered to back of device)which

Paste

Electronics Forum | Mon Apr 19 20:54:34 EDT 2004 | dave

Rob: We're never heard of paste related problems caused by humidity that is too low. Low humidity is very expensive to control. So, when you think about all the assembly used to be done in the Bay Area. You'd think there would be more talk about i

Immersion Silver Reliability / Peelable mask

Electronics Forum | Wed May 26 06:59:10 EDT 2004 | davef

Some peelable solder masks attack immersion finishes. It appears components in the peelable soldermask, such as ammonia, are not very friendly to these particular surface finish. [We've wanted to investigate the effect of mask application thickness

Immersion Silver Reliability / Peelable mask

Electronics Forum | Sun May 30 09:35:27 EDT 2004 | davef

Sure, I'd expect your PCB fab has given you a information sheet on handling, storage, and whatnot, including recommended temporary solder masks. The cats & kitties in the stockroom are the first people to start your search. It's probably squirreled

Chemicals in Aqeous Cleaners

Electronics Forum | Wed Apr 21 21:27:11 EDT 2004 | davef

Dreamy "Ball rolling"? Are you a bowler? My nephew does the audio for the ESPN2 production of the professional bowling tour. Search the fine SMTnet Archives for discussion on assessing cleaning machines. For instance: http://www.smtnet.com/forum


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