Electronics Forum: use (Page 1726 of 2487)

Air Bath Rework System

Electronics Forum | Fri Aug 13 19:59:48 EDT 2004 | Hi CJ.

Don't be discouraged about the Zephyrtronics Air Baths from Chris' comments. I'm sure he means well, but I've seen these units being used by people who swear by them. You might also look at the APE preheating units and the Zephyrtronics...but you sh

Warming up solder paste at start of days production

Electronics Forum | Thu Jul 22 06:33:28 EDT 2004 | Grant

Hi, I wondered how people warmed up solder paste at the start of the days production. I saw some paste mixers at a show, but only saw ones that mixed small solder paste tubs, not tubes. Can you get mixers that handle tubes. They said these mixers a

Warming up solder paste at start of days production

Electronics Forum | Mon Jul 26 19:40:17 EDT 2004 | Grant

Hi, That's a good idea. I might head down the the 7-Eleven, and try it! I did not realize there is not too much to be gained by using refrigeration. We don't keep much paste in stock and buy it as we need it, so perhaps we should just keep it out r

Deciding On pad size using just the component footprint

Electronics Forum | Thu Jul 22 12:02:52 EDT 2004 | lloyd

I'm currently having issues with a 28 terminal MLP package. I have only recently started in a new company and it seems as though the manufacturers guide lines as to pad geometry do not work (at least for us). So I now have a situation where I have 4

Deciding On pad size using just the component footprint

Electronics Forum | Sat Jul 24 09:06:40 EDT 2004 | davef

We believe that many manufacturers' recommended pads should be close to the last resort. Recommendations are: * Standardize with the IPC guidelines or those by Jim Blankenhorn [ smtplus.com ]. Anyone that wants to change from that standard needs to

ENIG Finish for BGA Designs

Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef

Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri

Royonics Bulbs

Electronics Forum | Wed Jul 28 10:29:20 EDT 2004 | johnthor

They are 6 volt, 10 watt bipin halogen and not hard to get. You do need to retain the metal housing. Take the screw out of the small pc board where the pins of the bulb project and pry it off. Scrape or grind out the hard material that holds the b

Un-Reflowed Paste

Electronics Forum | Wed Jul 28 00:13:03 EDT 2004 | NTV

We are seeing un-Reflowed paste along the IC > leads. There is only a very small amount imbedded > in the flux, typically there is about 10 beads > per lead. But on most leads. We are using > no-clean Kester 256 paste (Easy Profile)We have > not

Conf.Coating - Humiseal 1B31LOC vs. 1B31

Electronics Forum | Thu Jul 29 00:50:37 EDT 2004 | C.W

Anyone has experience with Humiseal 1B31LOC and 1B31? Their material properties(physical, chemical, temp. etc) are fairly much the same after cure but there are some differences when they are at liquid stage. We are currently using 1B31 but is planni

Very Low Alpha Count Solder/Solder Balls

Electronics Forum | Thu Jul 29 15:00:22 EDT 2004 | Sam Haq

Hi, I am trying to locate a vendor for very low alpha count solder balls. Solder is 63Sn/37Pb or 62Sn/36Pb/2Ag. Ball Specifications 63% tin / 37% lead solder (optional 2% silver in the form of 62/36/2 would be acceptable) 300 micron diameter


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