Electronics Forum | Thu Feb 10 14:56:50 EST 2005 | jimdugan
The Mydata machine is a very good high mix low volume machine. If you buy from Mydata you will be better supported, than if you buy from a broker. I would recommend you buy the newer My series machine. The TP machine was a good machine but the My ma
Electronics Forum | Fri Feb 11 18:59:21 EST 2005 | primus
We have been using Tape and Reel on our GSM for the SOIC-8 packages for a while, and it's working pretty well. Less operator error, less reloads, less jams (provided you take good care of the feeders) and LESS TUBES STUCK IN MY VCD SEQUENCER!!! I hav
Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ
This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi
Electronics Forum | Thu Feb 03 12:21:15 EST 2005 | Chunks
Lets get to the simple things. Wave or Reflow? Wave soldered parts have a higher susceptibility to physical damage until they are waved. That�s were I normally see this type of break. Usually, the crack is a circular pattern in the cap if it�s fr
Electronics Forum | Wed Feb 02 11:10:07 EST 2005 | jdengler
Hi AJ, I've never used the Flexa due to the price. We replaced our MCS with eSMT Software (web site http://www.esmt-software.com/). You might want to look at this if you don't need all of the Flexa features. We have older Fuji equipment (GSP's
Electronics Forum | Wed Feb 09 12:28:58 EST 2005 | Valerie
We have been pretty successful with screen printing glue, however the smallest component we now glue is a 0805. We had many problems using our Gemini II to put down glue dots for a 0603, so we altered the pads to do double-side reflow. As our own int
Electronics Forum | Wed Feb 09 12:31:54 EST 2005 | russ
We are not doing this right at the moment but I have done it with great success. Of cource it depends on your pad layout we have a 20 mil gap in between pads, we printed at 10 mil wide with a 5mil stencil. I will try to find the glue we used, I kno
Electronics Forum | Wed Feb 09 21:19:03 EST 2005 | Mrduckmann2000
Russ, We can not use a wave pallet, already went that route. We have parts next to the thru-hole pins and between thru-hole pins. I am going to try an experiment in the next day or so with solder mask. I plan to solder SMT parts on the back of se
Electronics Forum | Sat Feb 12 08:13:48 EST 2005 | pemnut
I have seen BEC holes drilled wrong also. On a couple of products We run, We insert a Pem Nut. The insertion hole is too large for BEC to read. So We have the board house drill a small hole for each array, circuit. If these smaller holes are drilled
Electronics Forum | Mon Feb 21 17:56:44 EST 2005 | davef
You want approximately 5 particles minimum across the smallest aperture. So in the case of a 0.8mm device, we use .017" pads with a round 0.020" aperture on a 6 thou thick stencil foils. Here, 0.020" diameter equals 0.50mm. This gives us 0.50/5=10
