Electronics Forum | Tue Nov 28 11:12:48 EST 2006 | billwestiet
The ONLY (unlikely) cause I could think of is if you are pushing the component into the solder, ending up with more solder on one side than the other. Why do you think it is the volume of solder that is causing this? By the way, there are "low tomb
Electronics Forum | Mon Nov 27 09:17:54 EST 2006 | lrd116
Could anyone please help me in my evaluation of Agilent vs. Omron vs. MIRTech/YESTech AOI? We are a high-mix low-to-mid volume manufacturer looking to gain not just a screening method but real process understanding that a Quality Engineer (myself) w
Electronics Forum | Tue Nov 28 05:31:04 EST 2006 | egrice
Lou, You should look at the ERSA/Modus AOI System! The Modus AOI uses a high resolution industrial scanner rather than a camera mounted to a gantry. It's way faster (12 seconds for whole board ) and can do everything that a camera can do and more
Electronics Forum | Thu Nov 30 15:19:56 EST 2006 | CK the Flip
Mike, dude, I feel your pain. Hearing stories like this makes my blood boil! It's almost as ridiculous as a customer who told me to put more solder paste on a MELF component to overcome noise issues - he used more solder paste as antennas to overco
Electronics Forum | Wed Nov 29 01:25:53 EST 2006 | callckq
Dear All, I have 1 product that using solder bar from vendor called Asahi. After wave process, we found quite a sticky flux residue remain on the board. Eventually, have huge impact on our ICT fisrt pass yield(FPY). Current FPY is a the range of
Electronics Forum | Fri Dec 01 06:31:53 EST 2006 | CHITRA K
We use SMBJ5.0A - D0214A package component in our products.During production recently we have identified a seroius problem. The problem is, After reflow soldering the impedance becomes more / lesser and due to which the product does not work since th
Electronics Forum | Mon Dec 04 12:32:45 EST 2006 | russ
Made no changes to pip process for lead free. Everything stayed the same. just have to ensure that components can withstand the high reflow temp. incomplete hole fill is from aperture not being big enough. Many people forget that paste reduces in
Electronics Forum | Fri Dec 15 03:16:11 EST 2006 | pavel_murtishev
Good morning, The critical points for successful PIP technology are: 1. Gap between THT lead and PHT hole. It shouldn�t be greater that 0.2mm; 2. Lead shape. THT leads MUST be straight or you�ll get excessive voiding otherwise; 3. As Russ said, pas
Electronics Forum | Thu Dec 07 07:36:15 EST 2006 | callckq
Hi Davef, The BGA pad is with ENIG finish, the PCB pad is with immersion silver and the solder paste is with SAC type. I already checked, the solder paste Cu is just 0.5%..Hence, I am guessing that copper migration is from PCB pad. No way it is fr
Electronics Forum | Wed Dec 06 08:29:50 EST 2006 | David
Hi Pavel, We regularly use over printing on a multitude of problem parts including fine pitch QFP's. In an Automotive Environment the only thing you can change without a mountain of paperwork is the stencil. best way to work out how much you can get
