Electronics Forum | Thu Jul 30 14:16:27 EDT 2009 | joeherz
We are running a selective solder machine using SN100C alloy. We have had J-STD-001 analysis performed every 2 months and our last analysis showed our nickel content at 0.104%. The max allowed is 0.100%. We changed out the pot (only 30 lbs) but I'
Electronics Forum | Wed Aug 05 11:08:36 EDT 2009 | spitkis2
Hi, This may be a bit off the subject but thought I'd ask just in case. I am looking to identify a process / equipment for attaching solder balls to flip chips. Solder balls are 75 microns in diameter. With BGA's there are reballing kits that use
Electronics Forum | Wed Aug 26 05:22:59 EDT 2009 | grahamcooper22
Hi Sergey, I agree with your probable cause. Maybe if you still have a component you can bake it before reflow to DRY it. Then if the problem doesn't happen in reflow you have surely proved the cause. Consult IPC JEDEC 33B spec for storage and Drying
Electronics Forum | Wed Aug 19 15:24:21 EDT 2009 | smt_guy
I have a customer who approved and asked us to process PCB's built with Lead-Free HASL Finish using Eutectic Solder. We did as directed and inspected the result from a 10-PCB Run and couldn't find any problem with solderability or issues. What Issue
Electronics Forum | Wed Aug 19 16:01:47 EDT 2009 | davef
You say, "using Eutectic Solder." * There are lots of eutectic solders. * When melted, a eutectic solder goes directly from a solid to liquid phase with no pasty phase. Do you mean 63/37 tin lead solder? If so, probably your assembly won't be RoHS
Electronics Forum | Wed Aug 19 18:18:02 EDT 2009 | smt_guy
Thanks Sir Dave. Yeah my apologies. To clarify, we built the product PCB whcih has a Lead-Free HASL Finish using a Sn63/Pb37 Solder paste. My major concern regarding reliability is that my profile whish is between 215'C-225'C was insufficient to ref
Electronics Forum | Wed Aug 26 18:58:07 EDT 2009 | rossi
I am not sure that it is the pillow problem. With the pillow problem you tend to see residual solder on the pad and voids where this solder pulled from on the ball. What we are seeing is a very thin flat layer of solder on the pad and a flat surface
Electronics Forum | Mon Aug 24 06:12:31 EDT 2009 | ghepo
joanne please pay attention, each heavy no-clean flux residues not completely heated due to hand soldering becomes a moisture absorbing conductive pathway, causing electrical leakage. So I suggest you to clean well the board after hand soldering or
Electronics Forum | Tue Nov 10 17:01:17 EST 2009 | jjune
2 days?? WOW! Here at our location, with MyData programming it takes on average for new projects a little over an hour with over 350 new parts. We use Aegis for both our offline programming as well as our MES and definitely have been happy with th
Electronics Forum | Tue Nov 29 19:48:10 EST 2011 | emrtech
I have created an excel macro that will work with my100 and my9. this macro (excel spreadsheet will work with excel 97 through 2007) will generate the PCB .gen file to import into my9 or my100. the components can also be imported before generating th
