Electronics Forum: use (Page 1851 of 2487)

Selective Solder Machine Solder Balls

Electronics Forum | Mon Jun 11 17:47:54 EDT 2012 | tombstonesmt

Pete B *We do lines of soldering @ 10mm/sec *Similar solder balls were present on product after soldering. *UPDATE SOLUTION* We began using topside preheat while fluxing the board to reduce the thermal shock factor in addition to replacing the "fi

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101

I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the

Universal conveyor

Electronics Forum | Thu Apr 19 07:42:53 EDT 2012 | leemeyer

I just purchased a used Universal Instruments Boardflo conveyor model 5363. It looked like it would be perfect to connect 2 of my Quad 4c machines in line. it came with a SMPI to Smema converter box. I connected the box S1PL and S2PL to what I beleiv

SMD Capasitor

Electronics Forum | Tue Apr 24 02:34:31 EDT 2012 | abyan

Hi..i have o project to make 3A Power supply, and i want to make it using SMD. I want to ask you about SMD capasitor, because i'm a newbie in this type of material.. Actually where could i found SMD capasitor with this specifications: -) 6800uf 35vol

Underscreen cleaning cycles

Electronics Forum | Fri May 11 14:19:14 EDT 2012 | cyber_wolf

Regarding nano coatings : Nano coatings are susceptible to wear during the printing process and cleaning processes. As they wear they flake off and can potentially contaminate your solder. There is not a lot of independent data available on this so k

BGA Alignment

Electronics Forum | Mon Apr 30 08:34:08 EDT 2012 | almoore

We use a small surface mount connector that has two alignment pins to ensure proper alignment. It works fairly well. I'm thinking that this simple alignment solution might work well with lead less parts like a BGA or QFN. I can hand assemble QFNs

Tin Mitigation Processes

Electronics Forum | Mon Apr 30 18:34:35 EDT 2012 | hegemon

Pure Tin terminations can be mitigated for components with solder terminations less than .030" in height from the PCB, by using 6 mil stencil with Sn63/pb37 solder paste. That's the simple story for our customers that require it. Beyond that height w

Entry-Level PnP + BGA?

Electronics Forum | Tue May 08 16:00:55 EDT 2012 | scottjwarren

The Dima PnP machines look really nice -- exactly the size and capabilities we will need for the next 3-5 years. Apparently, however, they are supported in the US by Manncorp. I have nothing personally against Manncorp, but have heard bits here and

How to define solder paste printing height tolerance

Electronics Forum | Mon May 07 10:42:09 EDT 2012 | saju86ece

Hi, I need one clarification about solder paste printing height tolerance. How to define and fix the solder paste height tolerance after screen printing for inspection purpose. Currently we are using 5mils thickness of stencil, in that we are gave

Conformal Coating Issues

Electronics Forum | Fri May 18 06:49:58 EDT 2012 | kahrpr

We us a lot of 1B31 it could be one of the most common coatings out there. We do not clean the boards and do not have an issue. I would check the solder mask compatibly. I would also see how the 3rd party company is testing the boards what criteria o


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