Electronics Forum: use (Page 191 of 2487)

Thermo-couple attachment

Electronics Forum | Wed May 07 09:53:39 EDT 2003 | cyber_wolf

Thanks for the response Dave. FYI: In my experience using the light cure adhesive, I have found that the newer the adhesive is the less prone it is to popping off during a reflow cycle. Also I have found that it only takes a very small amount to sec

BGA shorts that can't be found.

Electronics Forum | Fri Sep 12 06:02:55 EDT 2003 | Neil Trelford, Nortel

Even though you use a no clean process, it is still possible that some type of fluid has created the "short". Production lines are notorious for using cleaning chemicals on PCBs to clean excess flux after rework on other areas. Unless this type of c

Laying down and holding large components

Electronics Forum | Thu May 22 14:16:40 EDT 2003 | MikeF

We need more information to give you a good answer. Is this a leaded part (axial or radial) or smt? How big is the part, how much weight per lead? What is the end use environment, will it see any vibration? or temperature extremes? Some general com

OMNIFLOW 10

Electronics Forum | Mon Sep 08 06:50:45 EDT 2003 | cyber_wolf

Thanks. I have another question. I believe this machine was originally set up to run nitrogen. In the cooling section there are two chambers. One with a radiator air/nitrogen knives and the other section/chamber has a blower. Instead of running nitr

FLux, PBGA & Lead Free

Electronics Forum | Fri Oct 24 18:07:50 EDT 2003 | russ

Flux is used with both lead and lead free. Lead free usually or always uses a no-clean chemistry while lead uses both no-clean and water soluble dependent upon the application. As far as temp profiling a standard way to go is melting point + 30 C. f

BGA soldering

Electronics Forum | Mon Oct 27 16:58:34 EST 2003 | Stephen

The most common way is to screen print paste for the SMT placement, then then SMT placement then reflow then TH placement followed by wave solder. You won't be able to screen print for the BGA after reflow unless you use a mini stencil. Or you co

lead-free mixed technolgy

Electronics Forum | Thu Nov 06 09:10:13 EST 2003 | successmani

hi, NEMI recommends separate solders for reflow sodlering and wave soldering. Reflow soldering- Sn-3.9Ag-0.7Cu Wave sodlering- Sn-0.7CU Wavesoldering- Sn-0.7Ag What will happen if a mixed technolgy PCb board containing both through hole and surface

Anyone who has experience on IPC-TM650 environment test 2.6.3.1

Electronics Forum | Mon Nov 17 14:14:15 EST 2003 | blnorman

The main function of the test is to evaluate the solder mask. Basically you are testing three samples: #1 - No solder mask, #2 - solder mask without solder, and #3 solder mask with solder. The solder pot is used to apply solder to the patterns on O

SMT Component Tape Standards

Electronics Forum | Wed Nov 26 10:46:45 EST 2003 | caldon

For a general rough rule of thumb I use Practical Components for programming our machines. Practical has a nice layout of most Tape and Reel components and sizes. We use this mostly for tape/ feeder allocation. But for QC, Specs, and Other Stuff we

Squegge Angle for Fine pitch?

Electronics Forum | Tue Dec 16 04:20:51 EST 2003 | ex maintain leader

Hi Cesar, I' think is not soo critical, but take cre my 5Y experiences are focused mostly bad designed pcb's on outrunning project wich are transfered to eastern europe or to mini factories in austria. at wery old dek265 I see 45 degrees squeegue


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