Electronics Forum | Thu Dec 06 11:01:19 EST 2001 | Carol Stirling
This SMT process certainly makes a body want to win the $$$ and retire! We have been trying to stabalize the process and keep running into new problems. Any help would be appreciated on this issue. All pads on both sides have the same look - partial
Electronics Forum | Thu Dec 06 19:46:08 EST 2001 | davef
First, we�re assuming that we�re talking hot air solder leveled [HASL] bare boards, eh? Consider using A-600 - Acceptability of Printed Boards as the basis for discussing the bare board problems. It is the bare board analog of A-610 - Acceptability
Electronics Forum | Fri Dec 07 10:56:24 EST 2001 | franciscoioc
HI, I exeperience this problem before and I tried diferent type of solder pastes.The one that help my process is a Kester solder R596L OA this is a water soluble paste that i am very sure is going to help you.You can get the technical data at http:/
Electronics Forum | Fri Dec 07 15:23:27 EST 2001 | davef
I'm with Brian. TIN COATED 0603 FAILURES Welcome to the lead-free generation. ;-) The Eurolanders are so blanking stupid, it just makes my head hurt. But then again, it doesn�t take much. OK, enough pontification. Your profile is setup incorrec
Electronics Forum | Thu Dec 13 20:54:23 EST 2001 | davef
There is neither �nominal thickness� nor �is there a set maximum� for via masking. We use some of our vias as test pads. So, as you�d expect, we get rabid when we get mask bleed onto these pads. IPC-6012 - Qualification & Performance For Rigid Pri
Electronics Forum | Wed Dec 19 02:24:40 EST 2001 | ianchan
Did I mention, we tried to use the same WS flux formulae to brush-cover the affected flex-PCB pads, and subject it to another round of water-wash, followed by oven-baking, and it still doesn't help abit? Oven bake : 100 deg-C, approx 15~30mins (manu
Electronics Forum | Wed Dec 19 09:56:20 EST 2001 | guicho_v
I'm new in SMT world, and I've got my 1st challenge: I'm having de-wetting issues with a specific IC 160 pins MQFP (six location, failure is random), where one pin has de-wetting (solder reflow OK, and there is evidence of having contact the past and
Electronics Forum | Wed Jan 02 12:11:32 EST 2002 | mparker
Ian is correct in saying that the Cert.s and x-section should be forwarded to QA. It would be the responsibility of Incoming or Receiving Inspection to validate the materials. Your suppliers are offering proof that they comply to industry standards o
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Wed Jan 09 11:09:53 EST 2002 | slthomas
Is anyone still using Loctite 348 chipbonder for bottom side attachment? Is it truly adequate for dispensing up to 18k/hour? We will be dispensing with a Camelot 2800, so somewhere in the neighborhood of 15k/hr. is as fast as we'll ever see. I'm c