Electronics Forum | Wed Nov 15 13:44:32 EST 2006 | sliebl
Paul, That's what I thought you were going to say. I can do the same thing with my Contact machines, although I do not have feeder handling carts to pull entire banks of feeders, it would have to be done individually. Even though we are a small to mi
Electronics Forum | Fri Nov 17 19:28:36 EST 2006 | rob@spinpcb.com
What kind of board finish do you have? You describe solder bubbles...and when you remove them, you find open vias. Are you, by chance, discovering flux contained in these bubbles? We've been experiencing the same thing with pb-free soldering on a
Electronics Forum | Thu Nov 16 23:34:56 EST 2006 | mds33200
Hi, I am new in this industry and have purchased a beguinner unut, a 3-in-1 solder, desolder, hot air station. Currently I work on cellphone mainboards. At the moment I only replace single large chips on the mainboard. I would like to be able to repl
Electronics Forum | Fri Nov 17 16:24:18 EST 2006 | billwestiet
I'm in North Attleboro, small world. To answer your question, you can deposit small dots of paste with a syringe. Kind of tricky work, and there are small stencil soluions out there fairly inexpensively. See http://www.minimicrostencil.com/ (I do
Electronics Forum | Wed Nov 29 01:09:17 EST 2006 | Guess
I would suggest checking the feeder, MVF and MSR are both turret type and dont have the capability auto pik adjust in y. Y offset pick up would lead to : 1. Over turn component. 2. Missing component. Turret sequence is pick, recognize an
Electronics Forum | Thu Nov 30 12:12:14 EST 2006 | pbarton
I am in the process of characterising a new vapour phase reflow system and am interested to learn if anyone out there has ever come across time/temperature datalogging equipment capable of being run through the entire process (including vacuum) along
Electronics Forum | Mon Dec 04 12:35:11 EST 2006 | Rob
Hi AJ, Issues we have seen: Test houses not explaining results adequately/customers with their own XRF equipment not sure what they are looking for, resulting in lots of goods in rejections/requests to return stock mostly centered around: 1) Lead
Electronics Forum | Tue Dec 05 15:40:05 EST 2006 | jdengler
What year is your machine and what year is your Electric Drawing? My machine is 1989 and so is my drawing. I do not have a SIP-1750 drawing. The IP went through several changes during its production so your machine may not match mine. The CON I/F
Electronics Forum | Wed Dec 06 21:28:12 EST 2006 | davef
It's worse than just using the test equipment manufacturer guidelines. Along with that, you have to deal with each of the test fixture fabricators' preferences as well. What this boils down to is a negotiation with the test engineering group as to w
Electronics Forum | Thu Dec 07 00:55:51 EST 2006 | billylim
As you are aware the common method to rework BGA is : 1. Remove BGA with hot air reflow machine ( SRT as current practice) 2. Clean the BGA pad using solder iron and solder wick. 3. Replace BGA with SRT rework machine. The problem we have with
