Electronics Forum: use (Page 2316 of 2487)

Re: ESD mats

Electronics Forum | Wed Oct 27 22:58:56 EDT 1999 | Jeff Sanchez

Hany, John is right! How do I know cause I have a metal wire floor. I was faced with the same problem you are faced with now and the price was up there. I had one advantage, My floors where raised wood when we got the shop. This reduced the fati

Gold Immersion - Soft Joints

Electronics Forum | Mon Oct 25 14:48:29 EDT 1999 | William

All, I am having a problem with joints being soft after SMT. Especially 25 mil and smaller parts. It seems as though you can slide the leads right off of the solder. It takes only about 30-40 oz. of compression at 45 deg. to move leads off of join

Re: Wave process w/Alpha Metal 310M

Electronics Forum | Tue Oct 19 14:56:55 EDT 1999 | JohnW

Nick, I've run this flux for a while and it's not too bad. There is a tendancy for there to be residue left on the PCB after wave due to the solid's content but it can be minised by putting some effort into setting up your spray fluxer to an optimum

Re: Tombstoning

Electronics Forum | Tue Oct 12 16:08:44 EDT 1999 | Brian

| I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).

Re: Elimination of Silk Screen

Electronics Forum | Tue Oct 12 03:48:46 EDT 1999 | Chris May

| In a cost-reduction effort, our Design group is attempting to eliminate silk-screen (legend ink) on some new products. By the elimination of this process, there will be a slight decrease in the cost of the bare board. | | Presently, the silk scre

Re: bottom side epoxy

Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F

| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement

Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Fri Oct 01 10:04:20 EDT 1999 | Andrew William Dalrymple

I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at rewor

Re: Help I need DATA on Thermal shock caused by REWORK!

Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F

| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at

Re: Immersion Gold

Electronics Forum | Fri Oct 01 04:03:31 EDT 1999 | Brian

| I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | What is the best way to achi

Re: IR Versus Hot Air - Put-Up Your Dukes...........Not a lot of blood guys!!!

Electronics Forum | Tue Sep 28 12:58:19 EDT 1999 | Jeff Sanchez

I finaly get a vacation and decide to go to the forum and low and behold it's hot air verses a small ray of sun.I read every thread and still failed to see any real argument either way? I love rework as an assembler. I hate rework as a shop owner. Th


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