Electronics Forum | Fri Sep 21 16:00:55 EDT 2001 | davef
In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues associated with BGA: 7095, �Design and Assembly Process Implementation for BGA's� Your boards should be assembled in conformance with: *
Electronics Forum | Tue Sep 25 15:11:34 EDT 2001 | Rich Elensky
I have had good experience with the 6500. We used it to inspect both SMD and TH devices. (presence, polarity, correct part) I would suggest you contact CR (now Phton Dynamics) for the latest software. It has some serious improvments over early rel
Electronics Forum | Mon Sep 24 11:12:56 EDT 2001 | nwyatt
Hi. We are currently using an unconventional method to rework a micro BGA - removing component with hot air, fluxing the area, placing the part with pick and place, then reflowing it in the oven. The reason we are doing it this way and not with a r
Electronics Forum | Tue Oct 02 12:56:41 EDT 2001 | Scott B
We have come across this where the operator was using thin gauge solder wire (more suited to fine pitch SMT soldering) to form large solder fillets (power connections or sheild cans). We found that the operator was feeding large amounts of solder wir
Electronics Forum | Tue Oct 16 09:08:34 EDT 2001 | davef
Adding to Mike's comments. There are two types of selective wave soldering machines. * Chimney type, like the AirVac and Wenesco that Mike used. They use a boot to funnel the solder to the component to be soldered. * Programmable head type [ie, ERS
Electronics Forum | Wed Oct 17 02:53:36 EDT 2001 | dszeto
The fine pitch QFP is a 240 pin one being loaded with other components on a 2.0mm thick FR4 PCB. There are 6 of this Qfp's on this PCB showing the same charactristic of bowing therfore the solder fillets are vary from the center to the end of the pa
Electronics Forum | Mon Oct 22 17:47:47 EDT 2001 | davef
We on SMTnet have danced around this component package, but there is not a "background" of knowledge in the fine SMTnet Archives. We in our company use this component package, but have not seen the problems you discuss. [We see other problems.] Th
Electronics Forum | Tue Oct 23 09:09:27 EDT 2001 | Cemal Basaran
What is the reflow temperature you use to attach this package to your PCB.? I did extensive study on this package and compared it with other packages. I used our own Moire Interferometry, SEM, EDX studies. In my opinion the problem is TI does not man
Electronics Forum | Thu Nov 01 04:32:52 EST 2001 | wbu
Jonathan, we do that all day. We do not use different pastes nor do we glue components nor do we run different profiles. Depends on what is meant by "small components". In our case it�s all that "bird seed" up to SO8. That will work for more parts.
Electronics Forum | Mon Nov 26 05:56:54 EST 2001 | Scott Davies
We've used pump print stencils on and off for a couple of years now, and experimented with various epoxies. One supplier gave us some samples to try and we found that the adhesive they supply for normal metal stencil printing didn't work well with th
