Electronics Forum | Thu Feb 14 11:30:04 EST 2013 | davef
Yeh, I love the idea of tankless, but ... Tell ya what, when I'm at IPC APEX next week, I'll poke around on using tankless in a mid-to-low volume plant. BR, davef
Electronics Forum | Tue Feb 12 14:00:53 EST 2013 | dyoungquist
We have a board with a 1.0mm pitch BGA. The stencil apertures are 0.0177 inch diameter. We used an electroform stencil with good results.
Electronics Forum | Tue Feb 12 15:48:40 EST 2013 | emeto
My appertures are 10mil diameter. Using electroformed stencil is probably be my next step. Thank you!
Electronics Forum | Thu Feb 21 08:52:24 EST 2013 | emeto
Currently having Elecrtovert and BTU - no problems with both. Before use to have Vitronics aand Heller - and no problems with the rails. However I had other problems with Heller which makes me think that they are going deeper with the bad quality par
Electronics Forum | Mon Mar 04 16:15:32 EST 2013 | dyoungquist
A little oil on the dough, then the pizza sauce, then the toppings. Next place it in the reflow oven using a standard leaded reflow profile, might have to slow down the belt a bit. Should turn out a tasty pizza. ;-)
Electronics Forum | Wed Mar 06 10:29:40 EST 2013 | sara_pcb
What is the minimum solder mask thickness required for Class 3 products. We are insisting fabricator of the pcb shop to use only spray coated solder mask. The SM thickness on the epoxy is about 17 microns, In the center of the tracks are 8 microns an
Electronics Forum | Fri Apr 05 11:36:48 EDT 2013 | denisp
we use panasonic mv2vb feeder q type and we place a little piece of magnet under the reel and it help a lot
Electronics Forum | Thu Mar 21 13:23:15 EDT 2013 | cyber_wolf
Stay away from used Nitrogen ovens unless you have a specific need for it. The flux management is a pain in the arse to clean. I don't care how simple they claim it is.
Electronics Forum | Fri Mar 15 18:26:51 EDT 2013 | hegemon
We avoid kapton in this situation due to the thickness. 1 mil additional thickness can equal up to a 20% increase in paste volume at adjacent pads if you are using a 5 mil stencil. But then again, that is not always bad. But must be taken into consid
Electronics Forum | Fri Mar 22 12:57:30 EDT 2013 | bandjwet
Does anyone have any "tricks" for getting all of those little pieces of paper removed from the pad/ball side of a BGA after reballing. We are using the paper preforms and there are lots of those little preform remnants everywhere!
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